MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
P82B715TD,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.75 mm		3.9 mm					30	260	4.9 mm		BIPOLAR		5 V			1.27 mm		R-PDSO-G8	1	Not Qualified	e4
PCA9504ADGG,112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm		6.1 mm							14 mm		CMOS		3.3 V			.5 mm		R-PDSO-G56	1	Not Qualified	e4
PCA9504ADGG,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm		6.1 mm							14 mm		CMOS		3.3 V			.5 mm		R-PDSO-G56	1	Not Qualified	e4
TDA8002CG/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY		YES	6.5 V				3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	3 V	85 Cel		-25 Cel	TIN		QUAD	1.6 mm		5 mm							5 mm		CMOS	140 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G32	3	Not Qualified	e3
TDA8002CT/A/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V					SMALL OUTLINE		3 V	85 Cel		-25 Cel			DUAL	2.65 mm		7.5 mm							17.9 mm		CMOS		3.3 V			1.27 mm		R-PDSO-G28		Not Qualified
TDA8002CT/B/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V					SMALL OUTLINE		3 V	85 Cel		-25 Cel			DUAL	2.65 mm		7.5 mm							17.9 mm		CMOS		3.3 V			1.27 mm		R-PDSO-G28		Not Qualified
TDA8002CT/C/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V					SMALL OUTLINE		3 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm		7.5 mm							17.9 mm		CMOS		3.3 V			1.27 mm		R-PDSO-G28	3	Not Qualified	e4
TDA8002CT/C/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6.5 V					SMALL OUTLINE		3 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm		7.5 mm							17.9 mm		CMOS		3.3 V			1.27 mm		R-PDSO-G28	3	Not Qualified	e4
TDA8007BHL/C2,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	6 V				3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel		-40 Cel	SILVER		QUAD	1.6 mm		7 mm							7 mm		CMOS	315 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G48	1	Not Qualified	e4
TDA8007BHL/C3,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	6 V				3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	2.7 V	85 Cel		-40 Cel	Tin (Sn)		QUAD	1.6 mm		7 mm					30	260	7 mm		CMOS	315 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G48	1	Not Qualified	e3
FT245BM	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V					FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	TIN LEAD		QUAD	1.6 mm		7 mm						250	7 mm		CMOS		5 V			.8 mm		S-PQFP-G32	3	Not Qualified	e0
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES						CHIP CARRIER	LGA25,3X8,27		40 Cel		0 Cel			BOTTOM	1.781 mm		3.18 mm		NO		4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V			.686 mm	FIXED POINT	R-PBCC-B25
TCI6630K2LCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LDCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LDCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LXCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LXCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LXCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
TCI6630K2LXCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	.997 V					GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM								30	245			CMOS		.95 V					S-PBGA-B900	4		e1
MSP430F67491IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		14 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY				30	260	20 mm		CMOS		3.3 V			.5 mm		R-PQFP-G128	3		e4
MSP430F67491IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	32	14 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0		30	260	20 mm	32768	CMOS		3.3 V		I2C; SPI; UART	.5 mm		R-PQFP-G128	3		e4
MSP430F67491IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V					FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		14 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY				30	260	14 mm		CMOS		3.3 V			.5 mm		S-PQFP-G100	3		e4
NN325TRHARQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1 mm		6 mm			0	16 MHz	30	260	6 mm	1024	CMOS		2.7 V		I2C; SPI; UART	.5 mm		S-PQCC-N40	3		e4
TMS320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
P82B715DG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	1.75 mm		3.9 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR		5 V		I2C	1.27 mm		R-PDSO-G8	1	Not Qualified	e4
P82B715PE4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	12 V					IN-LINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	5.08 mm		7.62 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	9.81 mm		BIPOLAR		5 V		I2C	2.54 mm		R-PDIP-T8	1	Not Qualified	e4
TMS320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TIR1000PWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm		3 mm	CAN ALSO OPERATE AT 5V SUPPLY				30	260	4.4 mm		CMOS		3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TMS320DM335ZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm	32768	13 mm					30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM335ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm			32		30	260	13 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B337	3	Not Qualified	e1
AT43USB326-AU	Atmel	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY		YES					5	FLATPACK	QFP48,.35SQ,20		85 Cel		-40 Cel			QUAD													40 mA	5 V	Other Microprocessor ICs		.5 mm		S-PQFP-G48		Not Qualified
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm							19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified	e3
MCP25020-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm						260	8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm							8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm							8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V	TS 16949	8		5	IN-LINE	DIP14,.3	4.5 V	125 Cel		-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm							19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified	e3
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm							8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
MCP25050-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm						260	19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified	e3
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm							8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V	TS 16949	8		3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL	4.318 mm		7.62 mm							19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm		R-PDIP-T14		Not Qualified	e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm							8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	TS 16949	8		3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL	1.75 mm		3.9 mm							8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm		R-PDSO-G14	1	Not Qualified	e3
DM368ZCEDZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm					30	260	13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338	3		e1
DM368ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		13 mm					30	260	13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.