MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CC1310F32RHBR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

30

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

CC1310F64RGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

7 mm

30

260

7 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N48

3

e4

ADUCM330WDCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

ADUCM331WDCPZ-RL

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

18 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.6 V

115 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

.5 mm

S-XQCC-N32

CMX7341Q3

Cml Microcircuits

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N48

MSP430F67621AIPNR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

4

12 mm

0

30

260

12 mm

4096

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G80

3

e4

MSP430F67621AIPN

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

4

12 mm

0

30

260

12 mm

4096

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G80

3

e4

MSP430F67621AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

4

14 mm

0

30

260

14 mm

4096

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

MSP430F67621AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

4

14 mm

0

30

260

14 mm

4096

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

MSP430F67641AIPNR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

8

12 mm

0

30

260

12 mm

8192

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G80

3

e4

MSP430F67641AIPN

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

8

12 mm

0

30

260

12 mm

8192

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G80

3

e4

MSP430F67641AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

8

14 mm

0

30

260

14 mm

8192

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

MSP430F67641AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

8

14 mm

0

30

260

14 mm

8192

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

66AK2L06XCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

66AK2L06XCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

66AK2L06XCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

66AK2L06XCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

DLPC3439ZEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

201

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.045 V

85 Cel

-30 Cel

BOTTOM

1 mm

13 mm

13 mm

CMOS

1.1 V

.8 mm

S-PBGA-B201

DLPC410ZYR

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

85 Cel

0 Cel

BOTTOM

3 mm

27 mm

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1 V

1 mm

S-PBGA-B676

UCD3138ARGCR

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

YES

QUAD

1 mm

9 mm

0

2 MHz

30

260

9 mm

CMOS

3.3 V

I2C; UART

.5 mm

S-PQCC-N64

2

e4

X430FRL152HCRGER

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.65 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.45 V

70 Cel

0 Cel

QUAD

1 mm

4 mm

4 mm

CMOS

1.5 V

.5 mm

S-PQCC-N24

SP1ML-915

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

16

RECTANGULAR

UNSPECIFIED

NO

3.6 V

MICROELECTRONIC ASSEMBLY

1.8 V

85 Cel

-40 Cel

DUAL

2.5 mm

13.4 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3 V

1.5 mm

R-XDMA-N16

UCD3138ARGCT

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

YES

QUAD

1 mm

9 mm

0

2 MHz

30

260

9 mm

CMOS

3.3 V

I2C; UART

.5 mm

S-PQCC-N64

2

e4

UCD3138ARMHR

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

YES

QUAD

.8 mm

6 mm

0

2 MHz

30

260

6 mm

CMOS

3.3 V

I2C; UART

.5 mm

S-PQCC-N40

2

e4

UCD3138ARMHT

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

YES

QUAD

.8 mm

6 mm

0

2 MHz

30

260

6 mm

CMOS

3.3 V

I2C; UART

.5 mm

S-PQCC-N40

2

e4

CC1310F32RGZT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

7 mm

NOT SPECIFIED

260

7 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N48

3

e4

CC1310F32RHBT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

NOT SPECIFIED

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

CC1310F32RSMT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

4 mm

NOT SPECIFIED

260

4 mm

28672

CMOS

3.3 V

.4 mm

S-PQCC-N32

3

e4

CC1310F64RGZT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

7 mm

NOT SPECIFIED

260

7 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N48

3

e4

CC1310F64RHBT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

NOT SPECIFIED

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

CC1310F64RSMT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

4 mm

NOT SPECIFIED

260

4 mm

28672

CMOS

3.3 V

.4 mm

S-PQCC-N32

3

e4

DLPC910ZYR

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

676

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

.95 V

85 Cel

0 Cel

BOTTOM

3 mm

27 mm

27 mm

CMOS

1 V

I2C; USB

1 mm

S-PBGA-B676

MSP430F6749IPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

14 mm

0

25 MHz

30

260

14 mm

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

DLPC3438CZEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

201

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.045 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

1 mm

13 mm

30

260

13 mm

CMOS

1.1 V

.8 mm

S-PBGA-B201

3

e1

DLPC3439CZEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

201

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.045 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

1 mm

13 mm

30

260

13 mm

CMOS

1.1 V

.8 mm

S-PBGA-B201

3

e1

CYTMA525-49FNI25ZZT

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

BALL

49

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY

1.71 V

BOTTOM

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

CMOS

R-PBGA-B49

DRA746APGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY

TIN SILVER COPPER

BOTTOM

30

250

CMOS

X-PBGA-B760

3

1500 rpm

e1

EM341-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.9 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.18 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

7 mm

40

260

7 mm

CMOS

1.25 V

.5 mm

S-PQCC-N48

2

e3

XA7Z030-1FBV484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY

125 Cel

-40 Cel

BOTTOM

CMOS

S-PBGA-B484

XCZU9EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

DRA744BJGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1000 rpm

e1

DRA744BJGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1000 rpm

e1

DRA745BLGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1176 rpm

e1

DRA745BLGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1176 rpm

e1

DRA746BPGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1500 rpm

e1

DRA746BPGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1500 rpm

e1

DRA750BJGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

48

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1000 rpm

e1

DRA752BPGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

30

250

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

3

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.