MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
VCBUP7TC6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.3 mm		19 mm					NOT SPECIFIED	245	19 mm		CMOS			1.2 V				.8 mm		S-PBGA-B529	4		e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		13 mm			32		30	260	13 mm		CMOS			1.35 V			I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3		e1
VS3674UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		13 mm					30	260	13 mm		CMOS			1.35 V				.65 mm		S-PBGA-B338	3		e1
DM355SZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS			1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DM355SZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS			1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DM355SZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS			1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DM355SZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS			1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM355ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS			1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM6467ZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		3.3 mm	32768	19 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS			1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		3.3 mm	32768	19 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS			1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467ZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel			BOTTOM		3.3 mm	32768	19 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS			1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
TMS320DM6467ZUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		3.3 mm	32768	19 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm		CMOS			1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	8192	13 mm			32		30	260	13 mm		CMOS			1.35 V		Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
SN74LVT8996IPWREP	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm		4.4 mm			0		30	260	7.8 mm		BICMOS			3.3 V		Other Microprocessor ICs		.65 mm		R-PDSO-G24	1	Not Qualified	e4
AD6620ASZ-REEL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN		QUAD		3.4 mm		14 mm					40	260	14 mm		CMOS			3.3 V		DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified	e3
MXD1210CSA-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL		1.75 mm		3.9 mm							4.9 mm		CMOS		.5 mA	5 V				1.27 mm		R-PDSO-G8	1	Not Qualified	e0
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN		QUAD		3.4 mm		14 mm						260	14 mm		CMOS			3.3 V		DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified	e3
TMS320DM355ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	32768	13 mm					30	260	13 mm		CMOS			1.3 V		Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
SM320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm	20480	16 mm		ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY	48	27 MHz	30	260	16 mm		CMOS			1.2 V		Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TIR1000IPWG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm		3 mm		CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm		CMOS			3 V		Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TIR1000IPWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm		3 mm		CAN ALSO OPERATE AT 5V SUPPLY			30	260	4.4 mm		CMOS			3 V		Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V					SMALL OUTLINE		2.7 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL		2 mm		5.3 mm		CAN ALSO OPERATE AT 5V SUPPLY			30	260	6.2 mm		CMOS			3 V				1.27 mm		R-PDSO-G8	1	Not Qualified	e4
STA2058EXATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V					GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel			BOTTOM		1.7 mm		10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS			3.3 V				.8 mm		S-PBGA-B144		Not Qualified
STA2058EXA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V					GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel			BOTTOM		1.7 mm		10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS			3.3 V				.8 mm		S-PBGA-B144		Not Qualified
STA2058EXTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V					GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel			BOTTOM		1.7 mm		10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS			3.3 V				.8 mm		S-PBGA-B144		Not Qualified
STA2058EX	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V					GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm		10 mm					30	260	10 mm		CMOS			3.3 V				.8 mm		S-PBGA-B144	3	Not Qualified	e1
STA2058	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V					FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm		10 mm					30	260	10 mm		CMOS			3.3 V				.5 mm		S-PQFP-G64	3	Not Qualified	e4
STMPE16M31QTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel	MATTE TIN		QUAD		.9 mm		4 mm					40	260	4 mm		CMOS			1.8 V				.4 mm		S-XQCC-N32	3	Not Qualified	e3
STMPE24M31QTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V	85 Cel	-40 Cel	MATTE TIN		QUAD		.9 mm		5 mm					30	260	5 mm		CMOS			1.8 V				.4 mm		S-XQCC-N40	3	Not Qualified	e3
HCTL-2017	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	PIN/PEG	16		RECTANGULAR	UNSPECIFIED	NO	5.5 V					MICROELECTRONIC ASSEMBLY		4.5 V	85 Cel	-40 Cel	MATTE TIN		DUAL										260			CMOS			5 V						R-XDMA-P16		Not Qualified	e3
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD		DUAL		1.5 mm		3.76 mm						245	3.94 mm		CMOS			3.3 V				1.27 mm		R-PDSO-C6	1	Not Qualified	e0
FT245RQ-TRAY	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel	-40 Cel			QUAD		1 mm		5 mm					40	260	5 mm		CMOS							.5 mm		S-XQCC-N32	3	Not Qualified
DLPC230TZDQRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100				GRID ARRAY		1.045 V	105 Cel	-40 Cel			BOTTOM		2.352 mm		23 mm							23 mm		CMOS			1.1 V				1 mm		S-PBGA-B324
AWR1443FQIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.17 mm		10.4 mm					30	260	10.4 mm	589824	CMOS			1.2 V				.65 mm		S-PBGA-B161	3		e1
AWR1443FQIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100				GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		1.2 mm		10.4 mm					30	260	10.4 mm	589824	CMOS			1.2 V				.65 mm		S-PBGA-B161	3		e1
ADUCM330WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel			QUAD		1 mm		6 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS						SPI	.5 mm		S-XQCC-N32
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel	0 Cel			DUAL		.6 mm		2 mm							3 mm		CMOS						SPI	.5 mm		R-PDSO-N8
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel			BOTTOM		.8 mm		7 mm		3.3V NOM SUPPLY ALSO AVAILABLE					7 mm		CMOS			1.8 V			I2C, QSPI, UART	.65 mm		S-PBGA-B84
ATWINC1500-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm		14.73 mm							21.72 mm		CMOS			3.3 V						R-XXMA-N28
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm		14.73 mm							21.72 mm		CMOS			3.3 V						R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm		14.73 mm							21.72 mm		CMOS			3.3 V						R-XXMA-N28
DLPC2607ZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.95 V	85 Cel	-30 Cel	TIN SILVER COPPER		BOTTOM										260			CMOS			1 V						S-PBGA-B176	3		e1
DLPC6401ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY		1.116 V	55 Cel	0 Cel			BOTTOM		2.36 mm		23 mm							23 mm		CMOS			1.2 V				1 mm		S-PBGA-B419
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		NO			CHIP CARRIER		2.3 V	70 Cel	-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm		17.5 mm	0		0		30	260	20.5 mm		CMOS	4-Ch 12-Bit		3.3 V	NO		I2C; SPI; UART	1.27 mm		R-XBCC-B63	3		e4	25
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V					GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel			BOTTOM		2.42 mm		27 mm			16	20 MHz			27 mm		CMOS			1.15 V			I2C; SPI; UART; USB	1 mm		S-PBGA-B516				9
CC3000MODT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	4.8 V					MICROELECTRONIC ASSEMBLY		2.7 V	70 Cel	-20 Cel			QUAD		2 mm		13.5 mm		SEATED HGT-NOM					16.3 mm		CMOS			3.6 V						R-XQMA-N46
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel	-40 Cel			QUAD		1 mm		5 mm							5 mm		CMOS			5 V				.5 mm		S-XQCC-N32
STWBC	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel	-40 Cel			QUAD		1 mm		5 mm							5 mm		CMOS			5 V				.5 mm		S-XQCC-N32

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.