MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 1,514

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVM1502-1LSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2LSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-1MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2MSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-1LLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1502-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1502-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVC1702-1LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1702-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1702-1MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1702-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVC1702-2MLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1702-2MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-1MLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-1MSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-2LSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1402-2MSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2MSENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1502-2LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1702-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1702-2LLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1702-2LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1702-2MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1702-1MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2HSIVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel	BOTTOM	3.75 mm	37.5 mm	37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVM1302-1LSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1302-1MLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2HSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.854 V	110 Cel	-40 Cel	BOTTOM	2.94 mm	31 mm	31 mm	CMOS	.88 V	.92 mm	S-PBGA-B1024
XCVM1302-2HSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVM1402-1MSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-2HSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVM1402-2LLENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-2LLENFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1502-2MLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-2MSINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1502-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1502-1MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1502-2MLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1502-2MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1702-1MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-1MSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-1MSINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1302-2LSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVM1302-2MLINSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-2MLENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1402-2MSENSVF1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVM1502-1LLINFVB1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel	BOTTOM	3.83 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.