SoC Other Function uPs,uCs & Peripheral ICs 174

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
MCIMX6Y1DVK05AA	NXP Semiconductors	SoC	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS		.5 mm	S-PBGA-B272	3
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MCIMX6Y2DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
EFR32MG1V132F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3.3 V	.5 mm	S-XQCC-N32
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm				5 mm	CMOS	1.1 V	.4 mm	S-XQCC-N40
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V	.5 mm	S-XQCC-N48
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V	.5 mm	S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V	.5 mm	S-XQCC-N48
MCIMX6Y2CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289
MCIMX6Y2CVM08AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289
MCIMX6DP4AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
MCIMX6DP6AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS		.5 mm	S-PBGA-B272	3
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel		BOTTOM	3.35 mm	35 mm				35 mm	TSMC		1 mm	S-PBGA-B1152
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS		.8 mm	S-PBGA-B529	3	e1
MCIMX6Y1DVK05AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS		.5 mm	S-PBGA-B272	3
MCIMX6Y1DVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3	e1
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3	e1
MCIMX6D4AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MCIMX6D4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6D4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MCIMX6D5EYM10AER	NXP Semiconductors	SoC	OTHER	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MCIMX6Q4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3
MCIMX6Q6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6X1EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS		.8 mm	S-PBGA-B400	3	e1
MCIMX6X3EVN10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS		.8 mm	S-PBGA-B400	3	e1
MCIMX6X3EVO10AC	NXP Semiconductors	SoC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS		.8 mm	S-PBGA-B400	3	e1
MCIMX6X4EVM10AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS		.8 mm	S-PBGA-B529	3	e1
MIMXRT1061CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
EFR32FG13P232F512GM48-D	Silicon Labs	SoC														MATTE TIN					40	260						2	e3
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel		BOTTOM	3.5 mm	40 mm				40 mm	TSMC		1 mm	S-PBGA-B1517
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
MIMX8MM5DVTLZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MIMX8MM5DVTLZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MGM220PC22HNA2	Silicon Labs	SoC		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	3.8 V	MICROELECTRONIC ASSEMBLY		1.8 V	105 Cel	-40 Cel		UNSPECIFIED	2.4 mm	12.9 mm	ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE			15 mm	CMOS	3 V	1.2 mm	R-XXMA-N31	3
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
MIMX8MQ6DVAJZIB	NXP Semiconductors	SoC														TIN SILVER					40	260						3	e2
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.