SoC Other Function uPs,uCs & Peripheral ICs 174

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MCIMX6Y2CVM05ABR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3		e1
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm				19 mm	CMOS	1.1 V	.8 mm	S-PBGA-B529
MIMX8MN5DVPIZCA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm				11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306
MIMX8MN3DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm		40	260	11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306	3
MIMX8MN1DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm		40	260	11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306	3
MIMX8MN5DVPIZDA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm				11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306
NRF52832-QFAB-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
S6J32HELTNSC2D000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm				24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32JELSNSC20000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	125 Cel	-40 Cel		QUAD	1.7 mm	24 mm				24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32JEKSNSE20000	Infineon Technologies	SoC		GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	125 Cel	-40 Cel		QUAD	1.7 mm	28 mm				28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
MCIMX6S5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3		e1
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3		e1
DRA829VMTGBALFRQ1	Texas Instruments	SoC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	24 mm			250	24 mm	CMOS	.8 V	.8 mm	S-PBGA-B827	3	2000 rpm	e1
EFR32MG24A410F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24A420F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24B010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24B010F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24B020F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24A021F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG24B020F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG24A010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
LS1023AXE7QQB	NXP Semiconductors	SoC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA621,25X25,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	1 V	.8 mm	S-PBGA-B621	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQQ-S4D92	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm				8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244LQI-S4D62	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm				8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZI-S4D83	Infineon Technologies	SoC		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm				12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244AZQ-S4D93	Infineon Technologies	SoC		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm				12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244AZI-S4D12	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D62	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D82	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm				8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZQ-S4D92	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D12	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm				8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
EFR32BG24B210F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32BG24A010F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32BG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32BG24A020F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32BG24A020F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32BG24B220F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
MIMX8DL1AVNFZBA	NXP Semiconductors	SoC		BALL	388		SQUARE	PLASTIC/EPOXY	YES									BOTTOM	1.7 mm	15 mm		40	260	15 mm	CMOS			S-PBGA-B388	3
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS250TFCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
MPFS250TS-1FCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V	.8 mm	S-PBGA-B484
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.