COMMERCIAL Other Function uPs,uCs & Peripheral ICs 75

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	Maximum Standby Current	Maximum Access Time
XOMAPL137AZKB3	Texas Instruments		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES			1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40		70 Cel	0 Cel			BOTTOM														Other Microprocessor ICs		1 mm		S-PBGA-B256		Not Qualified
MF0UL1101DUD,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel	-20 Cel																	Other Microprocessor ICs						Not Qualified
MF0UL1101DUF,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel	-20 Cel																	Other Microprocessor ICs						Not Qualified
MF0UL2101DUD,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel	-20 Cel																	Other Microprocessor ICs						Not Qualified
MF0UL2101DUF,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL												DIE OR CHIP		70 Cel	-20 Cel																	Other Microprocessor ICs						Not Qualified
R3910-CFAB-E1B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.525 mm	3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-XXMA-N25
R3910-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.525 mm	3.81 mm	SEATED HGT-NOM				30	260	5.59 mm		CMOS		1.25 V					R-XXMA-N25	3
SA3291A-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.777 mm	3.68 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	6.35 mm		CMOS		1.25 V					R-XXMA-N32
SB3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.525 mm	3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-XXMA-N25
SB3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.525 mm	3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-XXMA-N25
SB3231-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.525 mm	3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-XXMA-N25
SB3231-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.525 mm	3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-XXMA-N25
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES				CHIP CARRIER			40 Cel	0 Cel			BOTTOM	1.781 mm	3.18 mm					NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-PBCC-B25
SA3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES				CHIP CARRIER			40 Cel	0 Cel			BOTTOM	1.781 mm	3.18 mm					NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-PBCC-B25
RF430FRL154HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY		YES				CHIP CARRIER, VERY THIN PROFILE			70 Cel	0 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	4 mm	IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm		CMOS				I2C; SPI	.5 mm		S-PQCC-N24	2		e4
SA3291A-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES				MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED	1.777 mm	3.68 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	6.35 mm		CMOS		1.25 V					R-XXMA-N32
9LPRS511EGLFT	Integrated Device Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES			3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20		70 Cel	0 Cel	TIN		DUAL								260			CMOS		3.3 V	Clock Generators		.5 mm		R-PDSO-G64	1	Not Qualified	e3
MXD1210C/D	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED		YES	5.5 V			UNCASED CHIP		4.5 V	70 Cel	0 Cel	TIN LEAD		UPPER											CMOS	.5 mA	5 V					R-XUUC-N8	1	Not Qualified	e0
MXD1210CPA	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V			IN-LINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL	4.572 mm	7.62 mm							9.375 mm		CMOS	.5 mA	5 V			2.54 mm		R-PDIP-T8	1	Not Qualified	e0
MXD1210CWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL	1.75 mm	3.9 mm							9.9 mm		CMOS	.5 mA	5 V			1.27 mm		R-PDSO-G16	1	Not Qualified	e0
MXD1210CSA	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL	1.75 mm	3.9 mm							4.9 mm		CMOS	.5 mA	5 V			1.27 mm		R-PDSO-G8	1	Not Qualified	e0
SN74ACT8997DWR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		5	SMALL OUTLINE	SOP28,.4	4.5 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm	7.5 mm			0		30	260	17.9 mm		CMOS	100 mA	5 V	Other Microprocessor ICs		1.27 mm		R-PDSO-G28	1	Not Qualified	e4
SN74ACT8997DW	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		5	SMALL OUTLINE	SOP28,.4	4.5 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	2.65 mm	7.5 mm			0		30	260	17.9 mm		CMOS	100 mA	5 V	Other Microprocessor ICs		1.27 mm		R-PDSO-G28	1	Not Qualified	e4
TL16PNP100AFN	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY		YES	5.25 V		5	CHIP CARRIER	LDCC44,.7SQ	4.75 V	70 Cel	0 Cel			QUAD	4.57 mm	16.585 mm					NOT SPECIFIED	NOT SPECIFIED	16.585 mm		CMOS	.7 mA	5 V	Bus Controllers		1.27 mm		S-PQCC-J44		Not Qualified
TL16PNP100APT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V		5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	4.75 V	70 Cel	0 Cel			QUAD	1.6 mm	7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS	.7 mA	5 V	Bus Controllers		.5 mm		S-PQFP-G48		Not Qualified
AD892TJP	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY		YES				CHIP CARRIER			70 Cel	0 Cel	TIN LEAD		QUAD	4.57 mm	16.5862 mm	ALSO REQUIRES 12V SUPPLY						16.5862 mm		CMOS		5 V			1.27 mm		S-PQCC-J44		Not Qualified	e0
TI380FPAAFNL	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY		YES	5.25 V			CHIP CARRIER		4.75 V	70 Cel	0 Cel			QUAD	4.57 mm	19.13 mm							19.13 mm		CMOS		5 V			1.27 mm		S-PQCC-J52
SN75LVDS88BRDD	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	100	HVFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH		3 V	70 Cel	0 Cel			QUAD	1 mm	14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS		3.3 V			.5 mm		S-PQFP-G100		Not Qualified
PSD854F2V-90M	STMicroelectronics		COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY		YES			3.3	FLATPACK	QFP52,.52SQ		70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	N	QUAD										2359296 Bits	CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.635 mm		S-PQFP-G52		Not Qualified	e4	.0001 Amp	.00000009 ns
PSD854F2V-90J	STMicroelectronics		COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY		YES			3.3	CHIP CARRIER	LDCC52,.8SQ		70 Cel	0 Cel	Matte Tin (Sn)	N	QUAD										2359296 Bits	CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		1.27 mm		S-PQCC-J52		Not Qualified	e3	.0001 Amp	.00000009 ns
LH79520N0M000B1	NXP Semiconductors		COMMERCIAL	GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY		YES			1.8,3.3	FLATPACK	QFP176,.87SQ,16		70 Cel	0 Cel			QUAD														Other uPs/uCs/Peripheral ICs		.4 mm		S-PQFP-G176		Not Qualified
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC		YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel			BOTTOM														Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B256		Not Qualified
LH7A404N0E000B0A	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC		YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel			BOTTOM														Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B324		Not Qualified
PCA9504ADGG,112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm	6.1 mm							14 mm		CMOS		3.3 V			.5 mm		R-PDSO-G56	1	Not Qualified	e4
PCA9504ADGG,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm	6.1 mm							14 mm		CMOS		3.3 V			.5 mm		R-PDSO-G56	1	Not Qualified	e4
FT245BM	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V			FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	TIN LEAD		QUAD	1.6 mm	7 mm						250	7 mm		CMOS		5 V			.8 mm		S-PQFP-G32	3	Not Qualified	e0
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES				CHIP CARRIER	LGA25,3X8,27		40 Cel	0 Cel			BOTTOM	1.781 mm	3.18 mm		NO		4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V			.686 mm	FIXED POINT	R-PBCC-B25
TIR1000PWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.7 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	1.2 mm	3 mm	CAN ALSO OPERATE AT 5V SUPPLY				30	260	4.4 mm		CMOS		3 V	Serial IO/Communication Controllers	UART	.65 mm		R-PDSO-G8	1	Not Qualified	e4
MXD1210CSA-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V			SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL	1.75 mm	3.9 mm							4.9 mm		CMOS	.5 mA	5 V			1.27 mm		R-PDSO-G8	1	Not Qualified	e0
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V			SMALL OUTLINE		2.7 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	5.3 mm	CAN ALSO OPERATE AT 5V SUPPLY				30	260	6.2 mm		CMOS		3 V			1.27 mm		R-PDSO-G8	1	Not Qualified	e4
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V			SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD		DUAL	1.5 mm	3.76 mm						245	3.94 mm		CMOS		3.3 V			1.27 mm		R-PDSO-C6	1	Not Qualified	e0
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.56 mm	21 mm					30	260	21 mm		CMOS		1 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY		YES	.945 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.56 mm	21 mm					30	260	21 mm		CMOS		.9 V			.8 mm		S-PBGA-B625	3		e1
MCIMX280DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V			.8 mm		S-PBGA-B289	3
MCIMX283DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V			.8 mm		S-PBGA-B289	3		e1
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V			.8 mm		S-PBGA-B289	3
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	TS 16949		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel	0 Cel			DUAL	.6 mm	2 mm							3 mm		CMOS				SPI	.5 mm		R-PDSO-N8
DLPC6401ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	419	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			GRID ARRAY		1.116 V	55 Cel	0 Cel			BOTTOM	2.36 mm	23 mm							23 mm		CMOS		1.2 V			1 mm		S-PBGA-B419

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.