COMMERCIAL Other Function uPs,uCs & Peripheral ICs 75

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	DAC Channels	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Data EEPROM Size	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V	NO	CHIP CARRIER		2.3 V	70 Cel	-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	17.5 mm	0		0		30	260	20.5 mm	CMOS	4-Ch 12-Bit	3.3 V	NO	I2C; SPI; UART	1.27 mm	R-XBCC-B63	3	e4	25
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel			BOTTOM		2.42 mm	27 mm			16	20 MHz			27 mm	CMOS		1.15 V		I2C; SPI; UART; USB	1 mm	S-PBGA-B516			9
X430FRL152HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.65 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.45 V	70 Cel	0 Cel			QUAD		1 mm	4 mm							4 mm	CMOS		1.5 V			.5 mm	S-PQCC-N24
MCIMX6G0DVM05AA	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY	BGA289,17X17,32	1.15 V	95 Cel	0 Cel			BOTTOM		1.32 mm	14 mm					40	260	14 mm	CMOS					.8 mm	S-PBGA-B289	3
6AV2181-8XP00-0AX0	Siemens	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES			UNCASED CHIP			50 Cel	0 Cel			UPPER								NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V				R-XUUC-N
FT245BL-REEL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	MATTE TIN		QUAD		1.6 mm	7 mm					30	260	7 mm	CMOS		5 V			.8 mm	S-PQFP-G32	3	e3
ADSP-21583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3	e1
ADSP-21584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3	e1
ADSP-SC582KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3	e1
ADSP-SC583KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3	e1
ADSP-SC583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3	e1
ADSP-SC584KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
MCIMX283DVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS		1.45 V			.8 mm	S-PBGA-B289	3	e1
SIP007AFS001	Samsung	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED	271		RECTANGULAR	UNSPECIFIED	NO	5 V		MICROELECTRONIC ASSEMBLY		3.7 V	70 Cel	0 Cel			UNSPECIFIED		3.45 mm	36 mm							49 mm	CMOS		4.2 V			1.13 mm	R-XXMA-X271
MCIMX280DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS		1.45 V			.8 mm	S-PBGA-B289	3
MCIMX283DVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS		1.45 V			.8 mm	S-PBGA-B289	3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS		1.45 V			.8 mm	S-PBGA-B289	3
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel			BOTTOM		2.42 mm	27 mm			16	20 MHz			27 mm	CMOS		1.15 V		I2C; SPI; UART; USB	1 mm	S-PBGA-B516			9
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS		1.45 V			.8 mm	S-PBGA-B289	3	e1
ADSP-21584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm				500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel	-10 Cel	TIN		QUAD		1.6 mm	14 mm					40	260	14 mm	CMOS		1.35 V			.4 mm	S-PQFP-G128	3	e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.