OTHER Other Function uPs,uCs & Peripheral ICs 371

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
MFRC53001T/0FE,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				5	SMALL OUTLINE	SOP32,.4		85 Cel	-25 Cel		DUAL									250			40 mA	5 V	Other Microprocessor ICs		1.27 mm		R-PDSO-G32	3	Not Qualified
TDA8026ET/C2,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM								30	260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified	e1
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM									260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified
TDA8026ET/C2,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM									260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified
MF0ICU1001W/S7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel	-25 Cel																Other Microprocessor ICs						Not Qualified
MF0ICU1001W/U7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel	-25 Cel																Other Microprocessor ICs						Not Qualified
MF0ICU1101W/U7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel	-25 Cel																Other Microprocessor ICs						Not Qualified
MF0ICU1101W/S7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER												DIE OR CHIP		70 Cel	-25 Cel																Other Microprocessor ICs						Not Qualified
TDA8035HN/C1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V			3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel	-25 Cel		QUAD		1 mm		5 mm					260	5 mm	CMOS	220 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MFRC52301HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD								30	260			10 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified	e4
MFRC52301HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD								30	260			10 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified	e4
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MFRC63102HN,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								30	260			20 mA	5 V	Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MFRC63102HN,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD												20 mA	5 V	Other Microprocessor ICs		.5 mm		S-PQCC-N32		Not Qualified
MFRC63102HN,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD												20 mA	5 V	Other Microprocessor ICs		.5 mm		S-PQCC-N32		Not Qualified
MFRC63102HN,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD												20 mA	5 V	Other Microprocessor ICs		.5 mm		S-PQCC-N32		Not Qualified
SLRC61002HN,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								30	260			20 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
SLRC61002HN,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD												20 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32		Not Qualified
SLRC61002HN,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD												20 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32		Not Qualified
SLRC61002HN,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD												20 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32		Not Qualified
PR601HL/C1,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				3.3,5	FLATPACK	QFP100,.63SQ,20		70 Cel	-25 Cel		QUAD														Other Microprocessor ICs		.5 mm		S-PQFP-G100		Not Qualified
PN7120A0EV/C10801E	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES				1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM								30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PBGA-B49	3	Not Qualified	e1
TMS320DM335CZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	8192	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM335DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	8192	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM335DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM6441BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		32	1.05/1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	20480	16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP	48		30	260	16 mm	CMOS		1.05 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	e1
TMS320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	20480	16 mm		48		30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	e1
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm		13 mm				30	260	13 mm	CMOS		1.35 V			.65 mm		S-PBGA-B338	3		e1
TMS320DM6467CCUT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CGUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN LEAD	BOTTOM		3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			20	220	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e0
TMS320DM6467TCUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS		1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TCUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS		1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
CC3000MODR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	3.6 V			3.6	MICROELECTRONIC ASSEMBLY	LGA46(UNSPEC)	1.8 V	70 Cel	-20 Cel		UNSPECIFIED		2 mm		13.5 mm	SEATED HGT-NOM					16.3 mm	CMOS	275 mA	2.7 V	Serial IO/Communication Controllers				R-XXMA-N46		Not Qualified
CC3000MOD	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	3.6 V			3.6	MICROELECTRONIC ASSEMBLY	LGA46(UNSPEC)	1.8 V	70 Cel	-20 Cel		UNSPECIFIED		2 mm		13.5 mm	SEATED HGT-NOM					16.3 mm	CMOS	275 mA	2.7 V	Serial IO/Communication Controllers				R-XXMA-N46		Not Qualified
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	128			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm		2.01 mm				30	260	2.01 mm	CMOS	.03 mA	1.8 V			.4 mm		S-PBGA-B25	1		e1	20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	128			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm		2.01 mm				30	260	2.01 mm	CMOS	.03 mA	1.8 V			.4 mm		S-PBGA-B25	1		e1	20
XCC3000MOD	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		1.8 V	70 Cel	-20 Cel		UNSPECIFIED		2 mm		13.5 mm	SEATED HGT-NOM					16.3 mm	CMOS		2.7 V					R-XXMA-N46
TMS320DM6467CCUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467CCUTV6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM369ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
TMS320DM369ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES					GRID ARRAY			110 Cel	-25 Cel		BOTTOM											CMOS							R-PBGA-B484
TNETX15VEPGE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3 V	95 Cel	0 Cel		QUAD		1.6 mm		20 mm	ALSO REQUIRES 5V SUPPLY			NOT SPECIFIED	NOT SPECIFIED	20 mm	CMOS		3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G144		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.