OTHER Other Function uPs,uCs & Peripheral ICs 371

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
TMS320DM368ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6467CZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMX320DM365BZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel	0 Cel		BOTTOM	1.3 mm	8192	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm	CMOS		1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMS320DM6467TZUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6433ZDU4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	260	23 mm	CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		e1
DM355SDZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DM355SDZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DM355SDZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355CZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355DZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMX320DM355ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel		BOTTOM	1.3 mm	32768	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
TMX320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel		BOTTOM	1.3 mm	32768	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
TMS320DM6441AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS		1.05 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
HTCM400/EAE,122	NXP Semiconductors		OTHER		27			PLASTIC/EPOXY				5	MICROELECTRONIC ASSEMBLY	MODULE,27LEAD,1		85 Cel	-25 Cel													100 mA	5 V	Other uPs/uCs/Peripheral ICs						Not Qualified
TDA8002CG/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V		3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	3 V	85 Cel	-25 Cel	TIN	QUAD	1.6 mm		5 mm						5 mm	CMOS	140 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQFP-G32	3	Not Qualified		e3
TDA8002CT/A/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		3 V	85 Cel	-25 Cel		DUAL	2.65 mm		7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm		R-PDSO-G28		Not Qualified
TDA8002CT/B/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		3 V	85 Cel	-25 Cel		DUAL	2.65 mm		7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm		R-PDSO-G28		Not Qualified
TDA8002CT/C/C1,512	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm		7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm		R-PDSO-G28	3	Not Qualified		e4
TDA8002CT/C/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V			SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm		7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm		R-PDSO-G28	3	Not Qualified		e4
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM335ZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM335ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B337	3	Not Qualified		e1
DM368ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm				30	260	13 mm	CMOS		1.35 V			.65 mm		S-PBGA-B338	3			e1
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM8147SCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, HEAT SINK/SLUG		3.14 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY	48		NOT SPECIFIED	250	23 mm	CMOS		3.3 V		ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B684	4		1000 rpm	e1
OMAPL132EZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL138BZWTRB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS		1.3 V			.8 mm		S-PBGA-B361	3			e1
OMAPL138EZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
SN3490586	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TNETV1647GSTZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TNETV6446AINZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DM365ZCES	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
DM365ZCEW	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS		1.35 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B338	3			e1
TMSDM6467CCUT6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.