BALL Other Function uPs,uCs & Peripheral ICs 1,582

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XAZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU3EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.72 V		.8 mm	S-PBGA-B625	3	e1
XAZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel		BOTTOM	1.5 mm	13 mm					13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm					13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z007S-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel		BOTTOM	1.5 mm	13 mm					13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm					13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z007S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z012S-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z012S-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z012S-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z014S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z014S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z014S-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z014S-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z014S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z014S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm					17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z014S-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z014S-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm					19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
TCI6636K2HDDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm			30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm			30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm			30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm			30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
TCI6636K2HDXAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm	40 mm			30	245	40 mm	CMOS	1 V		1 mm	S-PBGA-B1517	4	e1
DRA781BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA781BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA782BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA783BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA786BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA786BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA787BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA787BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505LRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505MRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	32	32 MHz	30	250	15 mm	CMOS	1.06 V	I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA780BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1
DRA780BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100	GRID ARRAY		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm	15 mm	48	32 MHz	30	250	15 mm	CMOS	1.06 V	CAN; I2C; SPI; UART	.65 mm	S-PBGA-B367	3	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.