BALL Other Function uPs,uCs & Peripheral ICs 1,582

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm	31 mm				31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-L2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm				31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z100-L2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.1 mm	35 mm				35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
XC7Z100-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4376BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4376BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	.95 V		.65 mm	S-PBGA-B491	3		e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4377BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4377BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4377BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4378BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM4379BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3		e1
AM4379BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
66AK2L06XCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm		30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm		30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm		30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
66AK2L06XCMS	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm		30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4		e1
DLPC3439ZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel		BOTTOM	1 mm	13 mm				13 mm	CMOS	1.1 V		.8 mm	S-PBGA-B201
DLPC410ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V	85 Cel	0 Cel		BOTTOM	3 mm	27 mm		NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1 V		1 mm	S-PBGA-B676
DLPC910ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	0 Cel		BOTTOM	3 mm	27 mm				27 mm	CMOS	1 V	I2C; USB	1 mm	S-PBGA-B676
DLPC3438CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm	13 mm		30	260	13 mm	CMOS	1.1 V		.8 mm	S-PBGA-B201	3		e1
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm	13 mm		30	260	13 mm	CMOS	1.1 V		.8 mm	S-PBGA-B201	3		e1
CYTMA525-49FNI25ZZT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		BALL	49	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY		1.71 V				BOTTOM			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS				R-PBGA-B49
MCIMX6G0DVM05AA	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY	BGA289,17X17,32	1.15 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
DRA746APGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		AEC-Q100	GRID ARRAY					TIN SILVER COPPER	BOTTOM				30	250		CMOS				X-PBGA-B760	3	1500 rpm	e1
MCIMX6DP4AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6DP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6DP6AVT8AA	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6DP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6QP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6G1AVM05AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.15 V	125 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MCIMX6G1AVM07AA	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	125 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.