Industrial Field Programmable Gate Arrays (FPGA) 998

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU11P-L1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320	512	0.72	Grid Array	BGA1517,39X39,40	.698 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		e1		512		40 mm
XCKU13P-1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.876 V	42660	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	42660 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU13P-2FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.876 V	42660	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	42660 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU13P-L1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	HBGA	Square	Plastic/Epoxy	746550	Yes	.742 V	42660	304	.72	Grid Array, Heat Sink/Slug	BGA900,30X30,40	.698 V	1 mm	100 °C (212 °F)	42660 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm	It also Operates at 0.85 V	e1	30 s	304	245 °C (473 °F)	31 mm
XCKU15P-1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	.85	Grid Array	BGA1156,34X34,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1		668		35 mm
XCKU15P-1FFVA1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1760,42X42,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1517,39X39,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-1FFVE1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1760,42X42,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1156,34X34,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm		e1	30 s	668	245 °C (473 °F)	35 mm
XCKU15P-2FFVA1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1760,42X42,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1517,39X39,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-2FFVE1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	668	0.85	Grid Array	BGA1760,42X42,40	.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340	668	.72	Grid Array	BGA1156,34X34,40	.698 V	1 mm	100 °C (212 °F)	65340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	It also Operates at 0.85 V	e1		668		35 mm
XCKU3P-1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU3P-1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU3P-2FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-2FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU3P-2SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU3P-L1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-L1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340	304	0.72	Grid Array	BGA900,30X30,40	.698 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1		304		31 mm
XCKU3P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340	304	0.72	Grid Array, Fine Pitch	BGA784,28X28,32	.698 V	.8 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU5P-1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-2FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU5P-2SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-L1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1		304		27 mm
XCKU5P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120	304	.72	Grid Array, Fine Pitch	BGA784,28X28,32	.698 V	.8 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm	It also Operates at 0.85 V	e1	30 s	304	250 °C (482 °F)	23 mm
XCKU9P-1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU9P-2FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU9P-L1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.742 V	34260	304	0.72	Grid Array	BGA900,30X30,40	.698 V	1 mm	100 °C (212 °F)	34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCVU11P-1FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm				624		47.5 mm
XCVU11P-1FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm				624		47.5 mm
XCVU11P-2FLGF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	37320	624	.85	Grid Array	BGA1924,44X44,40	.825 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm				624		45 mm
XCVU11P-2FSGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm				624		47.5 mm
XCVU13P-1FHGA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.24 mm	52.5 mm				832		52.5 mm
XCVU13P-1FHGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm				832		52.5 mm
XCVU13P-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm				832		52.5 mm
XCVU13P-2FHGA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.24 mm	52.5 mm				832		52.5 mm
XCVU13P-2FHGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm				832		52.5 mm
XCVU13P-2FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm				832		52.5 mm
XCVU13P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm				832		52.5 mm
XCVU3P-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260	520	0.85	Grid Array	BGA1517,39X39,40	.825 V	1 mm	100 °C (212 °F)	49260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		e1	30 s	520	245 °C (473 °F)	40 mm
XCVU5P-1FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	75072 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm		e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU5P-1FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	75072 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm		e1	30 s	832	245 °C (473 °F)	47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.