Industrial Field Programmable Gate Arrays (FPGA) 998

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXMA5G4F31I3G	Intel	FPGA	Industrial	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.18 V	7170	TSMC	544	1.15	Grid Array, Heat Sink/Slug	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					544		31 mm
5AGXMA3D4F27I5G	Intel	FPGA	Industrial	Ball	672	HBGA	Square	Plastic/Epoxy	156000	Yes	1.13 V	5890	TSMC	416	1.1	Grid Array, Heat Sink/Slug	BGA672,26X26,40	1.07 V	1 mm	100 °C (212 °F)		5890 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672		2.7 mm	27 mm					416		27 mm
5AGXMA5G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					544		35 mm
5AGXFB3H4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	1.07 V	1 mm	100 °C (212 °F)		13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
LFD2NX-40-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-8BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm					92		12 mm
LFD2NX-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm					92		12 mm
LFD2NX-40-7BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92	1			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm					92		12 mm
LFD2NX-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1		30 s	111	260 °C (500 °F)	14 mm
1SD280PT1F55I1VG	Intel	FPGA	Industrial	Ball	2912	BGA	Square	Plastic/Epoxy	2800000	Yes				816		Grid Array	BGA2912,54X54,40		1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B2912		3.881 mm	55 mm					816		55 mm
XC7A25T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1286 MHz		150		10 mm
XC7A12T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A12T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150	0.95	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A75T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300	1	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm			1098 MHz		300		15 mm
XC7A25T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
XC7A12T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150	1	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1286 MHz		150		10 mm
XC7A25T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150	0.95	Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20	.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		e1	1098 MHz		150		10 mm
MPF100T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply				284		19 mm
1ST280EU2F50I2VG	Intel	FPGA	Industrial	Ball	2397	BGA	Square	Plastic/Epoxy	2800000	Yes		350000		440		Grid Array	BGA2397,49X49,40		1 mm	100 °C (212 °F)		350000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B2397		3.881 mm	50 mm		e1			440		50 mm
XCKU19P-1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85	Grid Array	BGA1760,42X42,40	.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm		e1			540		42.5 mm
XCKU19P-2FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm		e1			540		47.5 mm
XCKU19P-2FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85	Grid Array	BGA1760,42X42,40	.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm		e1			540		42.5 mm
XCKU19P-L1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.742 V	105300		540	0.72	Grid Array	BGA1760,42X42,40	.698 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm		e1			540		42.5 mm
XCKU19P-1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm		e1			540		47.5 mm
XCKU19P-L1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.742 V	105300		540	0.72	Grid Array	BGA2104,46X46,40	.698 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm		e1			540		47.5 mm
LIF-MDF6000-6KMG80I	Lattice Semiconductor	FPGA	Industrial	Ball	80	TFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742		37	1.2	Grid Array, Thin Profile, Fine Pitch	BGA80,10X10,26	1.14 V	.65 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B80		1.2 mm	7 mm					37		7 mm
LIF-MDF6000-6UMG64I	Lattice Semiconductor	FPGA	Industrial	Ball	64	VFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742		29	1.2	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	1.14 V	.4 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B64		1 mm	3.5 mm					29		3.5 mm
10CL080YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.25 V	5079		289	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm					289		23 mm
MPF300TS-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply				284	260 °C (500 °F)	19 mm
10CL120YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	119088	Yes	1.25 V	7443		277	1.2	Grid Array	BGA484,22X22,40	1.15 V	1 mm	100 °C (212 °F)		7443 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm					277		23 mm
MPF300T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply				284		19 mm
MPF100T-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply				284		19 mm
EP3SL70F780I3G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V	2700		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	100 °C (212 °F)		2700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply				488		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.