Industrial Field Programmable Gate Arrays (FPGA) 998

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S1400AN-4FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	667 MHz	30 s	408	225 °C (437 °F)	27 mm
XC3S1400AN-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3S200AN-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	667 MHz	30 s	160	240 °C (464 °F)	17 mm
XC3S400AN-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz		248		21 mm
XC3S400AN-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S50AN-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.97 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e4	280 MHz				20 mm
XC3S700AN-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S700AN-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XA3S1000-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	125 MHz	30 s	391	260 °C (500 °F)	17 mm
XA3S1500-4FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328		AEC-Q100	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		3328 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	125 MHz	30 s	487	250 °C (482 °F)	23 mm
XA3S1600E-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	376	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XA3S200-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	125 MHz	30 s	173	260 °C (500 °F)	20 mm
XA3S250E-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	158	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XA3S400-4FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	125 MHz	30 s	264	250 °C (482 °F)	23 mm
XA3S500E-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	158	500000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XA3S1500-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328		AEC-Q100	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		3328 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	125 MHz	30 s	487	260 °C (500 °F)	27 mm
XC6VHX250T-1FF1154I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS		320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1098 MHz		320		35 mm
XC6VHX250T-2FFG1154I	Xilinx	FPGA	Industrial	Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS		320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	320	245 °C (473 °F)	35 mm
XC6VHX380T-2FFG1154I	Xilinx	FPGA	Industrial	Ball	1154	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	320	245 °C (473 °F)	35 mm
XC6VHX380T-2FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX380T-2FFG1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		640		1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	640	245 °C (473 °F)	45 mm
XC6VLX130T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-1FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6VLX130T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX130T-1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX130T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-2FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No	e0	1286 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX130T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX130T-2FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-2FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1286 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX130T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-L1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		400		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX130T-L1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		400		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX195T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX195T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX195T-1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX195T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX195T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX195T-2FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1286 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX195T-L1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	.93 V		CMOS		400		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX195T-L1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	.93 V		CMOS		400		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX240T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX240T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX240T-1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No	e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX240T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX240T-1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX240T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.