Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCS10XL-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	466	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAXIMUM usable gates 10000	e3	217 MHz	30 s	112	260 °C (500 °F)	20 mm
XCS20XL-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	950	Yes	3.6 V	400	CMOS	113	7000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e3	217 MHz	30 s	113	260 °C (500 °F)	20 mm
XCS30XL-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	113	10000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e3	217 MHz	30 s	113	260 °C (500 °F)	20 mm
XCS40XL-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS	169	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 40000	e3	217 MHz	30 s	169	245 °C (473 °F)	28 mm
XC2S200-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		144	200000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	140	245 °C (473 °F)	28 mm
XC2S200-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		284	200000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 200000	e3	263 MHz	30 s	284	245 °C (473 °F)	28 mm
XC2S150-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		260	150000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 150000	e3	263 MHz	30 s	260	245 °C (473 °F)	28 mm
XC2S150-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		260	150000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 150000	e3	263 MHz	30 s	260	245 °C (473 °F)	28 mm
XC2S100-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600		144	100000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	140	245 °C (473 °F)	28 mm
XC2S100-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600		144	100000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz	30 s	140	245 °C (473 °F)	28 mm
XCV100E-6PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	158	32400	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	357 MHz	30 s	158	245 °C (473 °F)	32 mm
XC2S50-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		176	50000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 50000	e3	263 MHz	30 s	176	245 °C (473 °F)	28 mm
XC2S50-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		176	50000	2.5	1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 50000	e3	263 MHz	30 s	176	245 °C (473 °F)	28 mm
XCS40XL-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS	169	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 40000	e3	250 MHz	30 s	169	245 °C (473 °F)	28 mm
XCS20XL-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	950	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 20000	e3	217 MHz	30 s	160	245 °C (473 °F)	28 mm
XCS30XL-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	169	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 30000	e3	217 MHz	30 s	169	245 °C (473 °F)	28 mm
XC4VFX100-10FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX100-10FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	40 mm
XC4VFX100-11FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX100-11FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	40 mm
XC4VFX140-10FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	40 mm
XC4VFX20-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS	320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4VFX20-11FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS	320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1181 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4VFX40-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS	352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX60-10FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX60-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX60-11FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX60-11FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1181 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VLX100-10FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS	768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		12288 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	35 mm
XC4VLX100-10FF1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS	960		1.2		Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		12288 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e0	1028 MHz	30 s	960	225 °C (437 °F)	40 mm
XC4VLX100-11FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS	768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		12288 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XC4VLX100-12FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes	1.26 V	12288	CMOS	768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		12288 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XC4VLX15-10SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX160-10FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS	768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		16896 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	35 mm
XC4VLX160-10FF1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS	960		1.2		Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		16896 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e0	1028 MHz	30 s	960	225 °C (437 °F)	40 mm
XC4VLX160-11FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	152064	Yes	1.26 V	16896	CMOS	768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		16896 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1205 MHz	30 s	768	225 °C (437 °F)	35 mm
XC4VLX200-11FF1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	200448	Yes	1.26 V	22272	CMOS	960		1.2		Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		22272 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e0	1205 MHz	30 s	960	225 °C (437 °F)	40 mm
XC4VLX25-10SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1028 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX25-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX25-12SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1205 MHz	30 s	240	225 °C (437 °F)	17 mm
XC4VLX40-10FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VLX40-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX40-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-10FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VLX60-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX60-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX80-10FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	80640	Yes	1.26 V	8960	CMOS	768		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		8960 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.