Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S500E-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	158	500000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	657 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3S1000L-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1		30 s	221	260 °C (500 °F)	19 mm
XC3S1000L-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS	333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1		30 s	333	250 °C (482 °F)	23 mm
XC3S1000L-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS	173	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1		30 s	173	260 °C (500 °F)	17 mm
XC3S1500L-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes		3328	CMOS	221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e1		30 s	221	260 °C (500 °F)	19 mm
XC3S1500L-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes		3328	CMOS	333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1		30 s	333	250 °C (482 °F)	23 mm
XC3S1500L-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes		3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B676		2.6 mm	27 mm	No	e1			487		27 mm
XC3S4000L-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes		6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1		30 s	633	250 °C (482 °F)	31 mm
XC2VP50-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1050 MHz	30 s	852	245 °C (473 °F)	40 mm
XC2VP50-7FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1350 MHz	30 s	852	245 °C (473 °F)	40 mm
LFE3-17EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			222		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	375 MHz		222	250 °C (482 °F)	23 mm
LFE3-17EA-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-17EA-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	420 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-17EA-8FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	500 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-35EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			295		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	375 MHz		295	250 °C (482 °F)	23 mm
LFE3-35EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			310		1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	e1	375 MHz	30 s	310	250 °C (482 °F)	27 mm
LFE3-35EA-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-35EA-7FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			295		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	420 MHz		295	250 °C (482 °F)	23 mm
LFE3-35EA-8FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	500 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-70EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-7FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			295		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	420 MHz		295	250 °C (482 °F)	23 mm
LFE3-70EA-7FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-8FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			295		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	500 MHz		295	250 °C (482 °F)	23 mm
LFE3-70EA-8FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP15C-3FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	1932	Yes	3.465 V	1932	CMOS	300		1.8	1.8/2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.63 ns	1932 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	375 MHz	40 s	300	250 °C (482 °F)	23 mm
LFXP15C-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1932	Yes	3.465 V	1932	CMOS	188		1.8	1.8/2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.44 ns	1932 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
LFXP3C-3QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	136		1.8	1.8/2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.63 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	375 MHz	40 s	136	245 °C (473 °F)	28 mm
LFXP3C-3TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	62		1.8	1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.63 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3	375 MHz	40 s	62	260 °C (500 °F)	14 mm
LFXP3C-4TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	62		1.8	1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.53 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3	375 MHz	40 s	62	260 °C (500 °F)	14 mm
LFXP6E-3FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	720	Yes	1.26 V	720	CMOS	188		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.63 ns	720 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
LCMXO1200C-3MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		101		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO1200C-3TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3		40 s	113	260 °C (500 °F)	20 mm
LCMXO1200C-4TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3		40 s	113	260 °C (500 °F)	20 mm
LCMXO1200C-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		211		1.8	1.8/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO1200C-5TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		73		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO1200C-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3		40 s	113	260 °C (500 °F)	20 mm
LCMXO1200E-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1200	Yes	1.26 V	150		211		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO1200E-3TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1200	Yes	1.26 V	150		73		1.2	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO2280C-3MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		101		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO2280C-3TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		73		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO2280C-3TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO2280C-4TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		73		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO2280C-4TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO2280C-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		101		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO2280C-5TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		73		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO2280C-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		113		1.8	1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO2280E-4FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	2280	Yes	1.26 V	285		211		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO256C-3MN100C	Lattice Semiconductor	FPGA	Other	Ball	100	LFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V	32		78		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No	e1		30 s	78	260 °C (500 °F)	8 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.