Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU115-3FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520	832	1	1 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XCKU115-3FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520	832	1	1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XCVU080-2FFVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672	832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU080-2FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672	832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU080-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672	832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCVU080-3FFVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	1.03 V	672	832	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-2FFVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XCVU095-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			832		40 mm
XCVU095-3FFVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	768	832	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XCVU125-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	884	245 °C (473 °F)	42.5 mm
XCVU125-2FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XCVU160-2FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560	702	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU160-2FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560	702	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU160-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	1.03 V	1560	702	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU190-2FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95		Grid Array	BGA2577,51X51,40		.922 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577		4.01 mm	52.5 mm			e1			702		52.5 mm
XCVU190-2FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU190-2FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU190-3FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1		Grid Array	BGA2577,51X51,40		.97 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577		4.01 mm	52.5 mm			e1			702		52.5 mm
XCVU190-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU190-3FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCVU440-1FLGA2892C	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95		Grid Array	BGA2892,54X54,40		.922 V	1 mm	85 °C (185 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCVU440-1FLGB2377C	Xilinx	FPGA	Other	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95		Grid Array	BGA2377,49X49,40		.922 V	1 mm	85 °C (185 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm			e1			1456		50 mm
XCVU440-2FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95		Grid Array	BGA2892,54X54,40		.922 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCVU440-2FLGB2377E	Xilinx	FPGA	Other	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95		Grid Array	BGA2377,49X49,40		.922 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm			e1			1456		50 mm
XCVU440-3FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	1.03 V	2880	1456	1		Grid Array	BGA2892,54X54,40		.97 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XC7A15T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-2CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A15T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300		1		Grid Array			.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1					23 mm
XC7A15T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A15T-3CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A15T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-3CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300	250	1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A15T-L2CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300	250	0.9		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7A15T-L2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300	250	0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-L2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300	250	0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
LCMXO3LF-1300C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	160		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3LF-1300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LCMXO3LF-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
LCMXO3LF-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.