144 Field Programmable Gate Arrays (FPGA) 254

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XCV50-6CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

94

57906

2.5

1.2/3.6,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0.6 ns

384 CLBS, 57906 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

333 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV100-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.8 ns

600 CLBS, 108904 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

250 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV100-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

0.8 ns

600 CLBS, 108904 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

250 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV100-5TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

600 CLBS, 108904 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

294 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV100-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

0.7 ns

600 CLBS, 108904 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

294 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV100-6TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.6 ns

600 CLBS, 108904 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

333 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV50-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

98

57906

2.5

1.2/3.6,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.8 ns

384 CLBS, 57906 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

250 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV50-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

98

57906

2.5

1.2/3.6,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

0.8 ns

384 CLBS, 57906 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

250 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV50-5TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

98

57906

2.5

1.2/3.6,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

384 CLBS, 57906 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

294 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV50-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

98

57906

2.5

1.2/3.6,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

0.7 ns

384 CLBS, 57906 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

294 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV50-6TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

98

57906

2.5

1.2/3.6,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.6 ns

384 CLBS, 57906 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

333 MHz

30 s

98

225 °C (437 °F)

20 mm

XCV100E-6CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

94

32400

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

0.47 ns

600 CLBS, 32400 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

357 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV100E-7CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

94

32400

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.42 ns

600 CLBS, 32400 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

400 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV50E-6CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

94

20736

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.47 ns

384 CLBS, 20736 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

357 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV50E-6CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

94

20736

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

0.47 ns

384 CLBS, 20736 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

357 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV50E-7CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

94

20736

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.42 ns

384 CLBS, 20736 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

400 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV50E-7CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

94

20736

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

0.42 ns

384 CLBS, 20736 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

400 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV50E-8CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

94

20736

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.4 ns

384 CLBS, 20736 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

416 MHz

30 s

94

240 °C (464 °F)

12 mm

XC2S100-5TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

96

100000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

600 CLBS, 100000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

263 MHz

92

20 mm

XC2S15-5CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

432

Yes

2.625 V

96

CMOS

96

15000

2.5

1.5/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0.7 ns

96 CLBS, 15000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

263 MHz

30 s

92

240 °C (464 °F)

12 mm

XC2S15-5TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

432

Yes

2.625 V

96

90

15000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

96 CLBS, 15000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 15000

e4

263 MHz

86

20 mm

XC2S15-6CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

432

Yes

2.625 V

96

CMOS

96

15000

2.5

1.5/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0.6 ns

96 CLBS, 15000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

Maximum usable gates 15000

e0

263 MHz

30 s

92

240 °C (464 °F)

12 mm

XC2S30-5TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

972

Yes

2.625 V

216

96

30000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

216 CLBS, 30000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 30000

e4

263 MHz

92

20 mm

XC2S30-6CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

972

Yes

2.625 V

216

96

30000

2.5

1.5/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0.6 ns

216 CLBS, 30000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

Maximum usable gates 30000

e0

263 MHz

30 s

92

240 °C (464 °F)

12 mm

XC2S50-5TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

96

50000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

384 CLBS, 50000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 50000

e4

263 MHz

92

20 mm

XC2S50-6TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

96

50000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.6 ns

384 CLBS, 50000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 50000

e4

263 MHz

92

20 mm

XCS10XL-4CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

3 V

.8 mm

85 °C (185 °F)

1.1 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

MAXIMUM usable gates 10000

e0

217 MHz

30 s

112

240 °C (464 °F)

12 mm

XCS10XL-5CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

3 V

.8 mm

85 °C (185 °F)

1 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

MAXIMUM usable gates 10000

e0

250 MHz

30 s

112

240 °C (464 °F)

12 mm

XCS20XL-4CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

3 V

.8 mm

85 °C (185 °F)

1.1 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

Maximum usable gates 20000

e0

217 MHz

30 s

160

240 °C (464 °F)

12 mm

XCS20XL-5CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

3 V

.8 mm

85 °C (185 °F)

1 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

Maximum usable gates 20000

e0

250 MHz

30 s

160

240 °C (464 °F)

12 mm

XC2S100-5TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

96

100000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

0.7 ns

600 CLBS, 100000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

263 MHz

92

20 mm

XC2S15-5CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

432

Yes

2.625 V

96

CMOS

96

15000

2.5

1.5/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

0.7 ns

96 CLBS, 15000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

263 MHz

30 s

92

240 °C (464 °F)

12 mm

XC2S15-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

432

Yes

2.625 V

96

90

15000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

0.7 ns

96 CLBS, 15000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

263 MHz

86

20 mm

XC2S30-5CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

972

Yes

2.625 V

216

96

30000

2.5

1.5/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

100 °C (212 °F)

0.7 ns

216 CLBS, 30000 Gates

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

263 MHz

30 s

92

240 °C (464 °F)

12 mm

XC2S30-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

972

Yes

2.625 V

216

96

30000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

0.7 ns

216 CLBS, 30000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

263 MHz

92

20 mm

XC2S50-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

96

50000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

0.7 ns

384 CLBS, 50000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

263 MHz

92

20 mm

LAMXO640C-3TN144E

Lattice Semiconductor

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

640

Yes

3.465 V

80

AEC-Q100

113

1.8

Tray

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

125 °C (257 °F)

80 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Also Operates at 2.5 V and 3.3 V nominal supply

e3

40 s

113

260 °C (500 °F)

20 mm

LAMXO640E-3TN144E

Lattice Semiconductor

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

640

Yes

1.26 V

80

AEC-Q100

113

1.2

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

80 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

40 s

113

260 °C (500 °F)

20 mm

LFE2-12E-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

12000

Yes

1.26 V

1500

93

1.2

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

311 MHz

40 s

93

260 °C (500 °F)

20 mm

LFXP3C-3TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

384

Yes

3.465 V

384

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.63 ns

384 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

375 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP3C-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

384

Yes

3.465 V

384

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.44 ns

384 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

375 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP6C-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

720

Yes

3.465 V

720

CMOS

100

1.8

1.8/2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.44 ns

720 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

375 MHz

40 s

100

260 °C (500 °F)

20 mm

LFE2-6E-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6000

Yes

1.26 V

750

90

1.2

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.358 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

311 MHz

40 s

90

260 °C (500 °F)

20 mm

LFE2-6E-6TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6000

Yes

1.26 V

750

90

1.2

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.331 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

357 MHz

40 s

90

260 °C (500 °F)

20 mm

XC3S50A-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1584

Yes

1.26 V

176

CMOS

108

50000

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.71 ns

176 CLBS, 50000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

667 MHz

101

20 mm

XC3S50A-4TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1584

Yes

1.26 V

176

CMOS

108

50000

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.71 ns

176 CLBS, 50000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

667 MHz

101

20 mm

XC3S50A-4TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1584

Yes

1.26 V

176

CMOS

108

50000

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.71 ns

176 CLBS, 50000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

667 MHz

30 s

101

260 °C (500 °F)

20 mm

XC3S50A-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1584

Yes

1.26 V

176

CMOS

108

50000

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.62 ns

176 CLBS, 50000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

770 MHz

30 s

101

260 °C (500 °F)

20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.