144 Field Programmable Gate Arrays (FPGA) 254

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3S50AN-4TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

176

CMOS

50000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

4.97 ns

176 CLBS, 50000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

280 MHz

20 mm

XC3S50AN-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1584

Yes

1.26 V

176

CMOS

108

50000

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.62 ns

176 CLBS, 50000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

770 MHz

30 s

101

260 °C (500 °F)

20 mm

XA3S200-4TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

480

AEC-Q100

173

200000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

480 CLBS, 200000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

125 MHz

30 s

173

260 °C (500 °F)

20 mm

XA3S200-4TQG144Q

Xilinx

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

480

AEC-Q100

173

200000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

480 CLBS, 200000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

125 MHz

30 s

173

260 °C (500 °F)

20 mm

XA2S100E-6TQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

AEC-Q100

102

1.8

1.2/3.6,1.8 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

600 CLBS

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

No

e0

357 MHz

30 s

102

225 °C (437 °F)

XA2S100E-6TQ144Q

Xilinx

FPGA

Automotive

Gull Wing

144

QFP

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

AEC-Q100

102

1.8

1.2/3.6,1.8 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

125 °C (257 °F)

600 CLBS

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

No

e0

357 MHz

30 s

102

225 °C (437 °F)

XA2S50E-6TQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

AEC-Q100

102

1.8

1.2/3.6,1.8 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

384 CLBS

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

No

e0

357 MHz

30 s

102

225 °C (437 °F)

XA2S50E-6TQ144Q

Xilinx

FPGA

Automotive

Gull Wing

144

QFP

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

AEC-Q100

102

1.8

1.2/3.6,1.8 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

125 °C (257 °F)

384 CLBS

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

No

e0

357 MHz

30 s

102

225 °C (437 °F)

XC6SLX4-2TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3840

Yes

1.26 V

300

CMOS

100

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.26 ns

300 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

667 MHz

30 s

100

260 °C (500 °F)

20 mm

XC6SLX4-3TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3840

Yes

1.26 V

300

CMOS

100

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.21 ns

300 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

862 MHz

30 s

100

260 °C (500 °F)

20 mm

XC6SLX4-3TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3840

Yes

1.26 V

300

CMOS

102

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.21 ns

300 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

862 MHz

30 s

102

260 °C (500 °F)

20 mm

XC6SLX4-L1TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3840

Yes

1.05 V

300

CMOS

102

1

1,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

.95 V

.5 mm

85 °C (185 °F)

0.46 ns

300 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

102

20 mm

XC6SLX4-L1TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

3840

Yes

1.05 V

300

CMOS

100

1

1,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

.95 V

.5 mm

100 °C (212 °F)

0.46 ns

300 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

100

20 mm

XC6SLX9-3TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9152

Yes

1.26 V

715

CMOS

102

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.21 ns

715 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

862 MHz

30 s

102

260 °C (500 °F)

20 mm

XC6SLX9-L1TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9152

Yes

1.05 V

715

CMOS

102

1

1,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

.95 V

.5 mm

85 °C (185 °F)

0.46 ns

715 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

102

20 mm

XA3S100E-4TQG144Q

Xilinx

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

AEC-Q100

108

100000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

4.88 ns

240 CLBS, 100000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

572 MHz

30 s

80

260 °C (500 °F)

20 mm

XA3S250E-4TQG144Q

Xilinx

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

AEC-Q100

108

250000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

4.88 ns

612 CLBS, 250000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

572 MHz

30 s

80

260 °C (500 °F)

20 mm

LFXP2-5E-5TN144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

30 s

100

260 °C (500 °F)

20 mm

LFXP2-5E-7TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP2-8E-5TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.494 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP2-8E-5TN144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP2-8E-6TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.399 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP2-8E-6TN144I

Lattice Semiconductor

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.399 ns

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

LFXP2-8E-7TN144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

100

1.2

1.2,1.2/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

435 MHz

40 s

100

260 °C (500 °F)

20 mm

XC4005XL-09TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Typical gates = 3000-9000

e0

217 MHz

30 s

112

225 °C (437 °F)

20 mm

XC4010XL-09TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Typical gates = 7000-20000

e0

217 MHz

30 s

160

225 °C (437 °F)

20 mm

XC4013XL-09HT144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Typical gates = 10000-30000

e0

217 MHz

192

20 mm

XC4020XL-09HT144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

784

Yes

3.6 V

784

CMOS

224

13000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.2 ns

784 CLBS, 13000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Typical gates = 13000-40000

e0

217 MHz

224

20 mm

XC2S100E-6TQ144C

Xilinx

FPGA

Commercial Extended

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

202

37000

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

600 CLBS, 37000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates = 100000

e0

357 MHz

30 s

202

225 °C (437 °F)

20 mm

XC2S50E-6TQ144C

Xilinx

FPGA

Commercial Extended

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

182

23000

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

384 CLBS, 23000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates = 50000

e0

357 MHz

30 s

182

225 °C (437 °F)

20 mm

XC3S200-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

480

CMOS

97

200000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.61 ns

480 CLBS, 200000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

630 MHz

97

20 mm

XC3S200-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

4320

Yes

1.26 V

480

CMOS

97

200000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

0.61 ns

480 CLBS, 200000 Gates

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

630 MHz

97

20 mm

XC3S400-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8064

Yes

1.26 V

896

CMOS

97

400000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.61 ns

896 CLBS, 400000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

630 MHz

97

20 mm

XC3S400-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

8064

Yes

1.26 V

896

CMOS

97

400000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

0.61 ns

896 CLBS, 400000 Gates

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

630 MHz

97

20 mm

XC3S50-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

1.26 V

192

CMOS

97

50000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.61 ns

192 CLBS, 50000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

630 MHz

97

20 mm

XC3S50-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1728

Yes

1.26 V

192

CMOS

97

50000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

0.61 ns

192 CLBS, 50000 Gates

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

630 MHz

97

20 mm

XC2V250-4CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

92

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.44 ns

384 CLBS, 250000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

650 MHz

30 s

92

260 °C (500 °F)

12 mm

XC2V250-4CSG144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

92

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

0.44 ns

384 CLBS, 250000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

650 MHz

30 s

92

260 °C (500 °F)

12 mm

XC2V250-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

92

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.35 ns

384 CLBS, 250000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

820 MHz

30 s

92

260 °C (500 °F)

12 mm

XC2V40-4CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.44 ns

64 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

650 MHz

30 s

88

260 °C (500 °F)

12 mm

XC2V40-4CSG144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

0.44 ns

64 CLBS, 40000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

650 MHz

30 s

88

260 °C (500 °F)

12 mm

XC2V40-5CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.39 ns

64 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

750 MHz

30 s

88

260 °C (500 °F)

12 mm

XC2V40-5CSG144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

0.39 ns

64 CLBS, 40000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

750 MHz

30 s

88

260 °C (500 °F)

12 mm

XC2V40-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.35 ns

64 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

820 MHz

30 s

88

260 °C (500 °F)

12 mm

XC2V80-4CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1152

Yes

1.575 V

128

CMOS

92

80000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.44 ns

128 CLBS, 80000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

650 MHz

30 s

92

260 °C (500 °F)

12 mm

XC2V80-4CSG144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

1152

Yes

1.575 V

128

CMOS

92

80000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

0.44 ns

128 CLBS, 80000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

650 MHz

30 s

92

260 °C (500 °F)

12 mm

XC2V80-5CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1152

Yes

1.575 V

128

CMOS

92

80000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.39 ns

128 CLBS, 80000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

750 MHz

30 s

92

260 °C (500 °F)

12 mm

XC2V80-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

1152

Yes

1.575 V

128

CMOS

92

80000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.35 ns

128 CLBS, 80000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

820 MHz

30 s

92

260 °C (500 °F)

12 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.