1760 Field Programmable Gate Arrays (FPGA) 67

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7V585T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS	750		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		750
XC7VX330T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS	650		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		650
XC7VX485T-2FF1761C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	700	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		700
XC7VX690T-1FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	850		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XC7VX690T-2FF1761C	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	850		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1760				No	e0	1818 MHz		850
XC5VLX110-1FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX110-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX110-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX110-2FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX110-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX110-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX220-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	17280 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX220-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	17280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX220-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX220-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX220-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	17280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX330-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX330-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	25920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX330-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX330-2FF1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	25920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	1200	225 °C (437 °F)	42.5 mm
XC5VLX155-1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	12160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX155-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX155-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e0		30 s	800	225 °C (437 °F)	42.5 mm
XC5VLX155-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800	1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	12160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No	e1		30 s	800	225 °C (437 °F)	42.5 mm
1SG280HN1F43E1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm					704		42.5 mm
1SG280HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm					704		42.5 mm
1SG280HN1F43I2LG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes	.88 V	344125		704	0.85		Grid Array	BGA1760,42X42,40		.82 V	1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm					704		42.5 mm
1SG280HN3F43E3VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm					704		42.5 mm
1SG280HN3F43I3VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm					704		42.5 mm
1SG280LN3F43I1VP	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm					704		42.5 mm
XCKU115-1FLVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	832	245 °C (473 °F)	42.5 mm
XCKU115-1FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	832	245 °C (473 °F)	42.5 mm
XCKU115-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	832	245 °C (473 °F)	42.5 mm
XCKU115-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832	.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1			832		42.5 mm
XCKU115-3FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832	1	1 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	832	245 °C (473 °F)	42.5 mm
XCVU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s	832	245 °C (473 °F)	42.5 mm
XCVU095-2FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm		e1		30 s	832	245 °C (473 °F)	42.5 mm
XCVU125-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm		e1		30 s	884	245 °C (473 °F)	42.5 mm
XCVU125-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884	.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm		e1		30 s	884	245 °C (473 °F)	42.5 mm
XCKU085-1FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU085-1FLVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU095-1FFVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No	e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU085-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No	e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU095-1FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No	e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU085-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1			676		42.5 mm
XCKU095-2FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No	e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU085-3FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1	1 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	e1		30 s	676	245 °C (473 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.