1760 Field Programmable Gate Arrays (FPGA) 67

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU15P-1FFVA1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-1FFVA1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-1FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-1FFVE1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVA1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVE1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-3FFVA1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340		668	0.9		Grid Array	BGA1760,42X42,40		.873 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-3FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340		668	0.9		Grid Array	BGA1760,42X42,40		.873 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-L2FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668	0.72		Grid Array	BGA1760,42X42,40		.698 V	1 mm	110 °C (230 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		Also Operates at 0.85 V nominal supply	e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVA1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XC7VX690T-2FF1761I	Xilinx	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	850	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760				No		e0	1818 MHz		850
XCKU19P-1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XCKU19P-2FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XCKU19P-L1FFVJ1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.742 V	105300		540	0.72		Grid Array	BGA1760,42X42,40		.698 V	1 mm	100 °C (212 °F)		105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XCKU19P-1FFVJ1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XCKU19P-2FFVJ1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
XCKU19P-3FFVJ1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1842750	Yes	.927 V	105300		540	0.9		Grid Array	BGA1760,42X42,40		.873 V	1 mm	100 °C (212 °F)		105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.27 mm	42.5 mm			e1			540		42.5 mm
1SG085HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	841000	Yes		105125		704			Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		105125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.