484 Field Programmable Gate Arrays (FPGA) 465

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7K70T-1FB484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	65600	Yes			CMOS		185			1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	4			No		e0	1818 MHz	30 s	185	225 °C (437 °F)
XC7K70T-2FB484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic	65600	Yes			CMOS		185			1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B484	4			No		e0	1818 MHz	30 s	185	225 °C (437 °F)
XC7K160T-1FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K160T-1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K160T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K160T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K160T-3FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K70T-1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K70T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K70T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7K70T-3FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		285	1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
LCMXO2-2000UHC-4FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	2112	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-4000HC-4FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-4000HC-4FG484I	Lattice Semiconductor	FPGA		Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-4000HC-6FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-4000HC-6FG484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278	2.5	Tray	2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	278	250 °C (482 °F)	23 mm
LCMXO2-7000HC-4FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V				334	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	334	250 °C (482 °F)	23 mm
LCMXO2-7000HC-4FG484I	Lattice Semiconductor	FPGA		Ball	484	HBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V				334	2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	334	250 °C (482 °F)	23 mm
XC7K160T-L2FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675	CMOS		285	.9		0.9,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	Also Operates at 1 V supply	e1		30 s	285	250 °C (482 °F)	23 mm
XC7K70T-L2FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	.93 V	5125	CMOS		285	.9		0.9,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	Also Operates at 1 V supply	e1		30 s	285	250 °C (482 °F)	23 mm
XA6SLX100-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS	AEC-Q100	326			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		326	250 °C (482 °F)
XA6SLX100-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS	AEC-Q100	326			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz	30 s	326	250 °C (482 °F)
XA6SLX25-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	266			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	266	250 °C (482 °F)
XA6SLX25T-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	250			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	250	250 °C (482 °F)
XA6SLX25T-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	250			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	250	250 °C (482 °F)
XA6SLX45-2CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	320			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	667 MHz		320
XA6SLX45-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411		AEC-Q100; TS 16949	316	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	316	250 °C (482 °F)	23 mm
XA6SLX45-3CSG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes			CMOS	AEC-Q100	320			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	862 MHz		320
XA6SLX45-3FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	316			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	316	250 °C (482 °F)
XA6SLX45-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100; TS 16949	316			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	316	250 °C (482 °F)
XA6SLX45T-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	296	250 °C (482 °F)
XA6SLX45T-3FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	296	250 °C (482 °F)
XA6SLX45T-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes				AEC-Q100	296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	296	250 °C (482 °F)
XA6SLX75-2CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328	1.23			Grid Array, Fine Pitch	BGA484,22X22,32		1.2 V	.8 mm	125 °C (257 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			328		19 mm
XA6SLX75-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	280			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	280	250 °C (482 °F)
XA6SLX75-3CSG484Q	Xilinx	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831			328	1.2			Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	125 °C (257 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e1			328		19 mm
XA6SLX75-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	280			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	280	250 °C (482 °F)
XA6SLX75T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		AEC-Q100; TS 16949	268	1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	268	250 °C (482 °F)	23 mm
XA6SLX75T-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	268			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	268	250 °C (482 °F)
XA6SLX75T-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	268			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	268	250 °C (482 °F)
XC6SLX100-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		338	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		338		19 mm
XC6SLX45T-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		296	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	296	250 °C (482 °F)	23 mm
XC6SLX75T-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		268	1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	268	250 °C (482 °F)	23 mm
XC7A200T-2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS		285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A100T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS		285	1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.