484 Field Programmable Gate Arrays (FPGA) 465

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFXP2-17E-7FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS		358		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	435 MHz		358	250 °C (482 °F)	23 mm
XC3S1400A-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S1400A-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S1400A-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S1400A-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S1400A-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		375	1400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	770 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S700A-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S700A-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S700A-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S700A-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S700A-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	770 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3SD1800A-4CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD1800A-4CSG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD1800A-5CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.62 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	280 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD3400A-4CS484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No	e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC3SD3400A-4CS484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	5968 CLBS, 3400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No	e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC3SD3400A-4CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD3400A-4CSG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	5968 CLBS, 3400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD3400A-5CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.62 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	280 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3S700AN-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S700AN-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S700AN-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S700AN-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S700AN-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	770 MHz	30 s	288	250 °C (482 °F)	23 mm
XA3S1600E-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	376	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XC3SD1800A-4CS484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No	e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC3SD1800A-4CSG484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS		309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 1800000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD3400A-4CS484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	5968 CLBS, 3400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No	e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC3SD3400A-4CSG484LI	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS		309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.71 ns	5968 CLBS, 3400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No	e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC6VLX130T-1FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6VLX130T-1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-2FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-2FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-L1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		240		.9	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-1FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6VLX75T-1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-2FF484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e0	1286 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6VLX75T-2FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e0	1286 MHz	30 s	240	220 °C (428 °F)	23 mm
XC6VLX75T-2FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-2FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX75T-L1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	.93 V		CMOS		240		.9	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6SLX100-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		320		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	667 MHz	30 s	320	260 °C (500 °F)	19 mm
XC6SLX100-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		320		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	667 MHz	30 s	320	260 °C (500 °F)	19 mm
XC6SLX100-2FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.