BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV2000E-8FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e0	416 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV200E-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200E-8FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	416 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV2600E-8FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	12696	CMOS	804	685584	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	12696 CLBS, 685584 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No			416 MHz		804		35 mm
XCV300E-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV300E-8FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	416 MHz	30 s	312	225 °C (437 °F)	23 mm
XCV400E-8FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	27 mm
XCV50E-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV600E-8FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	416 MHz	30 s	444	225 °C (437 °F)	27 mm
XC2S100-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600		180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S100-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	23 mm
XC2S100-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	23 mm
XC2S150-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		180	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 150000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S150-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		264	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 150000	e0	263 MHz	30 s	260	225 °C (437 °F)	23 mm
XC2S150-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		180	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 150000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S150-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		264	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 150000	e0	263 MHz	30 s	260	225 °C (437 °F)	23 mm
XC2S50-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		180	50000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 50000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S50-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		180	50000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 50000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV405E-6FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	27 mm
XCV405E-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	27 mm
XCV405E-7FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	27 mm
XCV405E-8FG676C	Xilinx	FPGA	Commercial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	27 mm
XC2S200-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		180	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 200000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		288	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 200000	e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC2S200-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		180	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 200000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		288	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 200000	e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV3200E-6CG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired	73008	Yes	1.89 V	16224	CMOS	804	876096	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e0	357.2 MHz		804		35 mm
XCV3200E-7CG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired	73008	Yes	1.89 V	16224	CMOS	804	876096	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e0	400 MHz		804		35 mm
XC2S100-5FG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600		180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S100-5FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s		225 °C (437 °F)	23 mm
XC2S150-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		180	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S150-5FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		264	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	260	225 °C (437 °F)	23 mm
XC2S200-5FG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		180	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		288	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC2S50-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384		180	50000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	384 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
LFE2-12E-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		193		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-12E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		193		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-12E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		297		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		297	250 °C (482 °F)	23 mm
LFE2-12E-6F484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V			297		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	357 MHz	30 s	297	225 °C (437 °F)	23 mm
LFE2-12E-6FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		193		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-12E-6FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		193		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-12E-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		193		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-50E-5FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.26 V	6000		339		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		339	250 °C (482 °F)	23 mm
LFE2-50E-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.26 V	6000		339		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		339	250 °C (482 °F)	23 mm
LFXP15C-4FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1932	Yes	3.465 V	1932	CMOS	188		1.8	1.8/2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.53 ns	1932 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
LFXP6E-3FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	720	Yes	1.26 V	720	CMOS	188		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.63 ns	720 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
XC5VLX110-1FF1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	800	225 °C (437 °F)	35 mm
XC5VLX110-1FF1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	800	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.