BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU15P-3FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340	668	0.9	Grid Array	BGA1156,34X34,40	.873 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm		e1		668		35 mm
XCKU15P-3FFVA1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340	668	0.9	Grid Array	BGA1760,42X42,40	.873 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-3FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340	668	0.9	Grid Array	BGA1517,39X39,40	.873 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-3FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340	668	0.9	Grid Array	BGA1760,42X42,40	.873 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340	668	.72	Grid Array	BGA1156,34X34,40	.698 V	1 mm	100 °C (212 °F)	65340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	It also Operates at 0.85 V	e1		668		35 mm
XCKU15P-L2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340	668	0.72	Grid Array	BGA1156,34X34,40	.698 V	1 mm	110 °C (230 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm	Also Operates at 0.85 V nominal supply	e1		668		35 mm
XCKU15P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340	668	0.72	Grid Array	BGA1517,39X39,40	.698 V	1 mm	110 °C (230 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	Also Operates at 0.85 V nominal supply	e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-L2FFVE1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340	668	0.72	Grid Array	BGA1760,42X42,40	.698 V	1 mm	110 °C (230 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	Also Operates at 0.85 V nominal supply	e1	30 s	668	245 °C (473 °F)	42.5 mm
XCKU3P-1FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-1FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-1FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU3P-1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU3P-2FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-2FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU3P-3FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.927 V	20340	304	0.9	Grid Array	BGA676,26X26,40	.873 V	1 mm	100 °C (212 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-3FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.927 V	20340	304	0.9	Grid Array	BGA676,26X26,40	.873 V	1 mm	100 °C (212 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-L1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU3P-L1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340	304	0.72	Grid Array	BGA900,30X30,40	.698 V	1 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1		304		31 mm
XCKU3P-L2FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	110 °C (230 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm	Also Operates at 0.85 V nominal supply	e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU5P-1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU5P-2FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA676,26X26,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU5P-3FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.927 V	27120	304	0.9	Grid Array	BGA676,26X26,40	.873 V	1 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-L1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		e1		304		27 mm
XCKU5P-L2FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	110 °C (230 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm	Also Operates at 0.85 V nominal supply	e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-L2FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120	304	0.72	Grid Array	BGA676,26X26,40	.698 V	1 mm	110 °C (230 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm	Also Operates at 0.85 V nominal supply	e1	30 s	304	250 °C (482 °F)	27 mm
XCKU5P-L2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120	304	0.72	Grid Array	BGA900,30X30,40	.698 V	1 mm	110 °C (230 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm	Also Operates at 0.85 V nominal supply	e1		304		31 mm
XCKU9P-1FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	34260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU9P-1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU9P-2FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260	304	0.85	Grid Array	BGA900,30X30,40	.825 V	1 mm	100 °C (212 °F)	34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCKU9P-L1FFVE900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.742 V	34260	304	0.72	Grid Array	BGA900,30X30,40	.698 V	1 mm	100 °C (212 °F)	34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s	304	245 °C (473 °F)	31 mm
XCVU065-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	44760	520	0.95	Grid Array	BGA1517,39X39,40	.922 V	1 mm	100 °C (212 °F)	44760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	Also Operates at 1 V nominal supply	e1	30 s	520	245 °C (473 °F)	40 mm
XCVU095-H1FFVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200	832	0.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm	Also Operates at 1 V nominal supply	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200	832	0.95	Grid Array	BGA1517,39X39,40	.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	Also Operates at 1 V nominal supply	e1	30 s	832	245 °C (473 °F)	40 mm
XCVU11P-1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm				624		52.5 mm
XCVU11P-1FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm				624		47.5 mm
XCVU11P-1FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm				624		47.5 mm
XCVU11P-1FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm				624		47.5 mm
XCVU11P-2FLGF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	37320	624	.85	Grid Array	BGA1924,44X44,40	.825 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm				624		45 mm
XCVU11P-2FSGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm				624		47.5 mm
XCVU11P-3FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000	624	0.9	Grid Array	BGA2104,46X46,40	.873 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm				624		47.5 mm
XCVU11P-L2FLGF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.742 V	162000	624	0.72	Grid Array	BGA1924,44X44,40	.698 V	1 mm	110 °C (230 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm	Also Operates at 0.85 V nominal supply			624		45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.