BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU095-2FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95	Grid Array	BGA1760,42X42,40	.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm	e1	30 s	832	245 °C (473 °F)	42.5 mm
XCVU095-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95	Grid Array	BGA1517,39X39,40	.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	e1	30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95	Grid Array	BGA1517,39X39,40	.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	e1	30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-2FFVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	832	.95	Grid Array	BGA1517,39X39,40	.922 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	e1		832		40 mm
XCVU095-3FFVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	768	832	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)		768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU125-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA1760,42X42,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	e1	30 s	884	245 °C (473 °F)	42.5 mm
XCVU125-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA1760,42X42,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	e1	30 s	884	245 °C (473 °F)	42.5 mm
XCVU125-2FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-2FLVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200	884	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU160-2FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU160-2FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU160-2FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU160-2FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU160-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	1.03 V	1560	702	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU190-2FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577		4.01 mm	52.5 mm	e1		702		52.5 mm
XCVU190-2FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU190-2FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU190-2FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2104,46X46,40	.922 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU190-3FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1	Grid Array	BGA2577,51X51,40	.97 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577		4.01 mm	52.5 mm	e1		702		52.5 mm
XCVU190-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU190-3FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1	Grid Array	BGA2104,46X46,40	.97 V	1 mm	100 °C (212 °F)		1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		702		47.5 mm
XCVU440-1FLGA2892C	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	85 °C (185 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm	e1		1456		55 mm
XCVU440-1FLGB2377C	Xilinx	FPGA	Other	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2377,49X49,40	.922 V	1 mm	85 °C (185 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm	e1		1456		50 mm
XCVU440-2FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm	e1		1456		55 mm
XCVU440-2FLGA2892I	Xilinx	FPGA	Industrial	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	100 °C (212 °F)		2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm	e1		1456		55 mm
XCVU440-2FLGB2377E	Xilinx	FPGA	Other	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2377,49X49,40	.922 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm	e1		1456		50 mm
XCVU440-2FLGB2377I	Xilinx	FPGA	Industrial	Ball	2377	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2377,49X49,40	.922 V	1 mm	100 °C (212 °F)		2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2377		3.83 mm	50 mm	e1		1456		50 mm
XCVU440-3FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	1.03 V	2880	1456	1	Grid Array	BGA2892,54X54,40	.97 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm	e1		1456		55 mm
XC7A100T-L1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925	285	.95	Grid Array		.92 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1	30 s	285	250 °C (482 °F)	23 mm
XC7A15T-1FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300		1	Grid Array		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1	30 s		250 °C (482 °F)	23 mm
XC7A15T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300		1	Grid Array		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1				23 mm
XC7A15T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300		1	Grid Array		.95 V	1 mm		1.05 ns	1300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1				23 mm
XC7A15T-3FGG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300		1	Grid Array		.95 V	1 mm		0.94 ns	1300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1				23 mm
XC7A200T-L1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825	285	.95	Grid Array		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	e1	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-L1FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825	400	.95	Grid Array		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	e1	30 s	400	250 °C (482 °F)	27 mm
XC7A35T-L1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	.98 V	2600		.95	Grid Array		.92 V	1 mm		1.27 ns	2600 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1				23 mm
XC7A50T-L1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075	250	.95	Grid Array		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	e1		250		23 mm
XC7K160T-L2FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	.97 V	12675		.95	Grid Array		.93 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	e1	30 s		250 °C (482 °F)	23 mm
XC7K160T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	12675		.95	Grid Array		.93 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	e1	30 s		250 °C (482 °F)	27 mm
XC7K160T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	12675		.95	Grid Array		.93 V	1 mm		0.61 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	e1	30 s		250 °C (482 °F)	27 mm
XC7K325T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475		.95	Grid Array		.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	e1	30 s		250 °C (482 °F)	27 mm
XC7K325T-L2FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475		.95	Grid Array		.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	e1	30 s		245 °C (473 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.