BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU27P-3FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	128700		676		0.9	Grid Array	BGA2104,46X46,40	.873 V	1 mm	100 °C (212 °F)		128700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm				676		52.5 mm
XCVU29P-2FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		676		0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm				676		52.5 mm
XCVU29P-2FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		676		0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm				676		52.5 mm
XCVU29P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000		676		0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm				676		52.5 mm
1SG280LN3F43I1VP	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes		344125		704			Grid Array	BGA1760,42X42,40		1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm				704		42.5 mm
MPF500TLFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			584		35 mm
5AGZME1H2F35I3LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		414		0.85	Grid Array	BGA1152,34X34,40	.82 V	1 mm	100 °C (212 °F)		8302 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm				414		35 mm
XC7A100T-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG	285		1	Grid Array	BGA484,22X22,40	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		e0	30 s	285	225 °C (437 °F)	23 mm
EP3SE80F1152C2G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744		0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply			744		35 mm
EP3SE80F1152C3G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744		0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply			744		35 mm
EP3SE80F780C4LG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200				.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm	Also Operates at 1.1 V VCC nominal					29 mm
EP3SL110F1152C4G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		744		0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)		4300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply			744		35 mm
EP3SL150F780C4G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488		0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)		5700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply			488		29 mm
A3P1000-FGG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS	300	1000000	1.5	Grid Array	BGA484,22X22,40	1.425 V	1 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B484		2.44 mm	23 mm				300		23 mm
MPF100T-1FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100T-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100T-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100TL-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100TL-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100TLS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100TS-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF100TS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF200T-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF200T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	364		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			364		29 mm
MPF200T-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF300T-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			512		35 mm
MPF300T-1FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF300T-1FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF300T-1FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF300T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			512		35 mm
MPF300T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF300T-FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF300TL-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			512		35 mm
MPF300TL-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			512		35 mm
MPF300TL-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF300TL-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF300TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			512		35 mm
MPF300TLS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm	It also Operates at 1.05 V nominal supply			244		23 mm
MPF300TLS-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF300TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm	It also Operates at 1.05 V nominal supply			512		35 mm
MPF300TS-1FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF300TS-FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF500T-1FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF500T-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF500T-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF500TL-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm
MPF500TLS-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm	It also Operates at 1.05 V nominal supply			388		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.