BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V8000-4FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	650 MHz	30 s	1108	245 °C (473 °F)	40 mm
XC2V8000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array			1.425 V	1 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	750 MHz	30 s	1108	245 °C (473 °F)	40 mm
XC2VP100-6FFG1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1040		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	11024 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1200 MHz	30 s	1040	245 °C (473 °F)	42.5 mm
XC2VP20-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	564	245 °C (473 °F)	35 mm
XC2VP20-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	564	245 °C (473 °F)	35 mm
XC2VP20-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP20-5FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP20-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	564	245 °C (473 °F)	35 mm
XC2VP20-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	564	245 °C (473 °F)	35 mm
XC2VP20-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP20-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s	564	245 °C (473 °F)	35 mm
XC2VP2-5FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1050 MHz	30 s	204	250 °C (482 °F)	27 mm
XC2VP2-6FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1200 MHz	30 s	204	250 °C (482 °F)	27 mm
XC2VP2-6FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	352 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1200 MHz	30 s	204	250 °C (482 °F)	27 mm
XC2VP30-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	644	245 °C (473 °F)	35 mm
XC2VP30-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	644	245 °C (473 °F)	35 mm
XC2VP30-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP30-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	644	245 °C (473 °F)	35 mm
XC2VP30-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	644	245 °C (473 °F)	35 mm
XC2VP30-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP30-6FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	556		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1200 MHz	30 s	556	245 °C (473 °F)	31 mm
XC2VP30-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s	644	245 °C (473 °F)	35 mm
XC2VP40-5FFG1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	804	245 °C (473 °F)	35 mm
XC2VP40-5FFG1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	804		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	804	245 °C (473 °F)	35 mm
XC2VP40-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP40-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP40-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP40-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP40-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP4-5FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS	348		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	752 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1050 MHz	30 s	348	250 °C (482 °F)	27 mm
XC2VP4-6FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS	348		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	752 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1200 MHz	30 s	348	250 °C (482 °F)	27 mm
XC2VP4-6FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS	348		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	752 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1200 MHz	30 s	348	250 °C (482 °F)	27 mm
XC2VP50-5FFG1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	812		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	812	245 °C (473 °F)	35 mm
XC2VP50-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	852		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	852	245 °C (473 °F)	35 mm
XC2VP50-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP50-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP50-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP50-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	5904 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2VP70-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1050 MHz	30 s	964	245 °C (473 °F)	40 mm
XC2VP70-5FFG1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s	996	245 °C (473 °F)	42.5 mm
XC2VP70-5FFG1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1050 MHz	30 s	996	245 °C (473 °F)	42.5 mm
XC2VP70-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	1200 MHz	30 s	964	245 °C (473 °F)	40 mm
XC2VP70-7FFG1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No	e1	1350 MHz	30 s	996	245 °C (473 °F)	42.5 mm
XC2VP7-5FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1050 MHz	30 s	396	250 °C (482 °F)	27 mm
XC2VP7-5FFG672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	1232 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e1	1050 MHz	30 s	396	250 °C (482 °F)	27 mm
XC2VP7-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	1050 MHz	30 s	396	245 °C (473 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.