BGA Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S200-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 200000	e1	263 MHz	30 s	284	250 °C (482 °F)	23 mm
XC2S150-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	260 °C (500 °F)	17 mm
XC2S100-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S150-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	260	260 °C (500 °F)	17 mm
XC2S200-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	284	260 °C (500 °F)	17 mm
XC2S200-5FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	263 MHz	30 s	284	250 °C (482 °F)	23 mm
XC2S150-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	260 °C (500 °F)	17 mm
XC2S100-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S100-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S50-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384			176	50000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S150-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			264	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	250 °C (482 °F)	23 mm
XC2S150-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	250 °C (482 °F)	23 mm
XC2S150-5FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	263 MHz	30 s	260	250 °C (482 °F)	23 mm
XC2VP30-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	3424 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2VP30-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2VP30-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2V3000-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	650 MHz	30 s	484	250 °C (482 °F)	27 mm
XC2V3000-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	650 MHz	30 s	484	250 °C (482 °F)	27 mm
XC2V3000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	750 MHz	30 s	484	250 °C (482 °F)	27 mm
XC2V3000-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	750 MHz	30 s	484	250 °C (482 °F)	27 mm
XC2V3000-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS		484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	820 MHz	30 s	484	250 °C (482 °F)	27 mm
XC2VP40-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2VP40-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1050 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2VP40-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2VP40-6FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	416	250 °C (482 °F)	27 mm
XC2VP40-7FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1350 MHz	30 s	416	250 °C (482 °F)	27 mm
XA3S1000-4FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	391	250 °C (482 °F)	23 mm
XA3S1000-4FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	391	250 °C (482 °F)	23 mm
XC4VFX100-10FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX100-10FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX100-10FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	40 mm
XC4VFX100-11FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX100-11FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX100-11FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	40 mm
XC4VFX100-11FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	40 mm
XC4VFX12-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		320		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1368 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e0	1028 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4VFX140-10FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS		768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1028 MHz	30 s	768	225 °C (437 °F)	40 mm
XC4VFX20-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4VFX20-10FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2136 CLBS		Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4VFX20-11FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1181 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4VFX20-11FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS		320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2136 CLBS		Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1181 MHz	30 s	320	220 °C (428 °F)	27 mm
XC4VFX40-10FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		448		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			4656 CLBS		Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	35 mm
XC4VFX40-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX40-10FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS		352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			4656 CLBS		Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX60-10FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX60-10FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC4VFX60-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm
XC4VFX60-10FF672I	Xilinx	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS		352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		6320 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	352	220 °C (428 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.