BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VSX35-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	34560	Yes	1.26 V	3840	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		3840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VSX55-10FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6144 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VSX55-10FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6144 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1028 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VSX55-11FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6144 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1205 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VSX55-11FF1148I	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6144 CLBS		Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1205 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VSX55-12FF1148C	Xilinx	FPGA	Other	Ball	1148	BGA	Square	Plastic/Epoxy	55296	Yes	1.26 V	6144	CMOS	640		1.2		Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6144 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1148	4	3.4 mm	35 mm	No	e0	1205 MHz	30 s	640	225 °C (437 °F)	35 mm
XC4VLX15-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	320		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4VLX15-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	320		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1536 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4VLX15-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	13824	Yes	1.26 V	1536	CMOS	320		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		1536 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4VLX25-10FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX25-10FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1028 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX25-11FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX25-11FF668I	Xilinx	FPGA		Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			2688 CLBS		Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC4VLX25-12FF668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No	e0	1205 MHz	30 s	448	225 °C (437 °F)	27 mm
XC2V1000-4FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1000-4FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1000-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1000-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	820 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1500-4FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1920	CMOS		1500000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	31 mm
XC2V1500-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1920	CMOS		1500000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	820 MHz	30 s		245 °C (473 °F)	31 mm
XC2V2000-4FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	650 MHz	30 s	624	245 °C (473 °F)	31 mm
XC2V2000-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	750 MHz	30 s	624	245 °C (473 °F)	31 mm
XC2V2000-5FFG896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array			1.425 V	1 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	31 mm
XC2V2000-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e1	820 MHz	30 s	624	245 °C (473 °F)	31 mm
XC2V3000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	720	245 °C (473 °F)	35 mm
XC2V3000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	720	245 °C (473 °F)	35 mm
XC2V3000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	35 mm
XC2V3000-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array			1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	35 mm
XC2V3000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.35 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	820 MHz	30 s		245 °C (473 °F)	35 mm
XC2V4000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V4000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V4000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V4000-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V4000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	820 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V4000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	820 MHz	30 s	912	245 °C (473 °F)	40 mm
XC2V6000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V6000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V6000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	650 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2V6000-4FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	650 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2V6000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V6000-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V6000-5FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	750 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2V6000-5FFG1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	750 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2V6000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	820 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V6000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	1104	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	820 MHz	30 s	1104	245 °C (473 °F)	40 mm
XC2V8000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.44 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array			1.425 V	1 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-4FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e1	650 MHz	30 s	1108	245 °C (473 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.