BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP40-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.32 ns	4848 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP40-7FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS		416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	1350 MHz	30 s	416	225 °C (437 °F)	27 mm
XA3SD1800A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	519	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	667 MHz	30 s	409	260 °C (500 °F)	27 mm
XA3SD1800A-4FGG676Q	Xilinx	FPGA	Automotive	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	AEC-Q100	519	37440	1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	0.71 ns	4160 CLBS, 37440 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	667 MHz	30 s	409	260 °C (500 °F)	27 mm
XA3SD3400A-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes		5968	CMOS	AEC-Q100	469	53712		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm			5968 CLBS, 53712 Gates		Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	667 MHz	30 s	409	260 °C (500 °F)	27 mm
XC3S1000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S1500-4FG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		221	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S400-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		221	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S400-4FG320I	Xilinx	FPGA		Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		221	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	896 CLBS, 400000 Gates		Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	630 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S400-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		221	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No	e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC2V1000-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz		328		31 mm
XC2V1000-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz		328		31 mm
XC2V1000-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	650 MHz	30 s	172	260 °C (500 °F)	17 mm
XC2V1000-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	650 MHz	30 s	172	260 °C (500 °F)	17 mm
XC2V1000-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	650 MHz	30 s	324	250 °C (482 °F)	23 mm
XC2V1000-4FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	650 MHz	30 s	324	250 °C (482 °F)	23 mm
XC2V1000-5BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz		328		31 mm
XC2V1000-5BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	1280 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz		328		31 mm
XC2V1000-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	750 MHz	30 s	172	260 °C (500 °F)	17 mm
XC2V1000-5FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	750 MHz	30 s	172	260 °C (500 °F)	17 mm
XC2V1000-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	750 MHz	30 s	324	250 °C (482 °F)	23 mm
XC2V1000-5FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	750 MHz	30 s	324	250 °C (482 °F)	23 mm
XC2V1000-6BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		328	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz		328		31 mm
XC2V1000-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	820 MHz	30 s	172	260 °C (500 °F)	17 mm
XC2V1000-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		324	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e1	820 MHz	30 s	324	250 °C (482 °F)	23 mm
XC2V1500-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz		392		31 mm
XC2V1500-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	1920 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz		392		31 mm
XC2V1500-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	650 MHz	30 s	392	250 °C (482 °F)	27 mm
XC2V1500-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1920 CLBS, 1500000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	650 MHz	30 s	392	250 °C (482 °F)	27 mm
XC2V1500-5BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz		392		31 mm
XC2V1500-5BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz		392		31 mm
XC2V1500-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	750 MHz	30 s	392	250 °C (482 °F)	27 mm
XC2V1500-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	1920 CLBS, 1500000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	750 MHz	30 s	392	250 °C (482 °F)	27 mm
XC2V1500-6BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz		392		31 mm
XC2V1500-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.575 V	1920	CMOS		392	1500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1920 CLBS, 1500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	820 MHz	30 s	392	250 °C (482 °F)	27 mm
XC2V2000-4BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz		408		31 mm
XC2V2000-4BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	650 MHz		408		31 mm
XC2V2000-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	650 MHz	30 s	456	250 °C (482 °F)	27 mm
XC2V2000-4FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	650 MHz	30 s	456	250 °C (482 °F)	27 mm
XC2V2000-5BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz		408		31 mm
XC2V2000-5BGG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	750 MHz		408		31 mm
XC2V2000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	750 MHz	30 s	456	250 °C (482 °F)	27 mm
XC2V2000-5FGG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	750 MHz	30 s	456	250 °C (482 °F)	27 mm
XC2V2000-6BGG575C	Xilinx	FPGA	Other	Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B575		2.6 mm	31 mm	No	e1	820 MHz		408		31 mm
XC2V2000-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS		456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e1	820 MHz	30 s	456	250 °C (482 °F)	27 mm
XC2V250-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	650 MHz	30 s	172	260 °C (500 °F)	17 mm
XC2V250-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e1	650 MHz	30 s	172	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.