BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LFXP2-8E-6FT256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

0.399 ns

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

435 MHz

30 s

201

225 °C (437 °F)

17 mm

LFXP2-8E-6FTN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.399 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

LFXP2-8E-6FTN256I

Lattice Semiconductor

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

100 °C (212 °F)

0.399 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

LFXP2-8E-7FTN256C

Lattice Semiconductor

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

201

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0.304 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

435 MHz

201

260 °C (500 °F)

17 mm

XC4VLX15-10FF676C

Xilinx

FPGA

Other

Ball

676

BGA

Square

Plastic/Epoxy

13824

Yes

1.26 V

1536

CMOS

320

1.2

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

1536 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

4

3 mm

27 mm

No

e0

1028 MHz

30 s

320

225 °C (437 °F)

27 mm

XC4VLX15-10FFG676C

Xilinx

FPGA

Other

Ball

676

BGA

Square

Plastic/Epoxy

13824

Yes

1.26 V

1536

CMOS

320

1.2

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

1536 CLBS

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B676

4

3 mm

27 mm

No

e1

1028 MHz

30 s

320

250 °C (482 °F)

27 mm

XC4VLX15-11FF676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

13824

Yes

1.26 V

1536

CMOS

320

1.2

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

1536 CLBS

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

4

3 mm

27 mm

No

e0

1205 MHz

30 s

320

225 °C (437 °F)

27 mm

XC4VLX25-11FFG676C

Xilinx

FPGA

Other

Ball

676

BGA

Square

Plastic/Epoxy

24192

Yes

1.26 V

2688

CMOS

448

1.2

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

2688 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

4

3 mm

27 mm

No

e1

1205 MHz

30 s

448

250 °C (482 °F)

27 mm

XC5VFX200T-1FF1738I

Xilinx

FPGA

Industrial

Ball

1738

BGA

Square

Plastic/Epoxy

196608

Yes

1.05 V

15360

CMOS

960

1

1,2.5 V

Grid Array

BGA1738,42X42,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

0.9 ns

15360 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1738

4

3.25 mm

42.5 mm

No

e0

30 s

960

225 °C (437 °F)

42.5 mm

XC2V1000-4BG575I

Xilinx

FPGA

Ball

575

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

328

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA575,24X24,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

1280 CLBS, 1000000 Gates

Tin Lead

Bottom

S-PBGA-B575

3

2.6 mm

31 mm

No

e0

650 MHz

328

225 °C (437 °F)

31 mm

XC2V1000-4FF896I

Xilinx

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

432

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

1280 CLBS, 1000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B896

4

3.4 mm

31 mm

No

e0

650 MHz

30 s

432

225 °C (437 °F)

31 mm

XC2V1000-4FG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

172

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

1280 CLBS, 1000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

650 MHz

30 s

172

225 °C (437 °F)

17 mm

XC2V1000-4FG456I

Xilinx

FPGA

Ball

456

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

324

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA456,22X22,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

1280 CLBS, 1000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B456

3

2.6 mm

23 mm

No

e0

650 MHz

30 s

324

225 °C (437 °F)

23 mm

XC2V1000-5BG575I

Xilinx

FPGA

Ball

575

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

328

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA575,24X24,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.39 ns

1280 CLBS, 1000000 Gates

Tin Lead

Bottom

S-PBGA-B575

3

2.6 mm

31 mm

No

e0

750 MHz

328

225 °C (437 °F)

31 mm

XC2V1000-5FF896I

Xilinx

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

432

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

1280 CLBS, 1000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B896

4

3.4 mm

31 mm

No

e0

750 MHz

30 s

432

225 °C (437 °F)

31 mm

XC2V1000-5FG256C

Xilinx

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

172

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

0.39 ns

1280 CLBS, 1000000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

750 MHz

30 s

172

225 °C (437 °F)

17 mm

XC2V1000-5FG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

172

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

1280 CLBS, 1000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

750 MHz

30 s

172

225 °C (437 °F)

17 mm

XC2V1000-5FG456I

Xilinx

FPGA

Ball

456

BGA

Square

Plastic/Epoxy

11520

Yes

1.575 V

1280

CMOS

324

1000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA456,22X22,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

1280 CLBS, 1000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B456

3

2.6 mm

23 mm

No

e0

750 MHz

30 s

324

225 °C (437 °F)

23 mm

XC2V1500-4BG575I

Xilinx

FPGA

Ball

575

BGA

Square

Plastic/Epoxy

17280

Yes

1.575 V

1920

CMOS

392

1500000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA575,24X24,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

1920 CLBS, 1500000 Gates

Tin Lead

Bottom

S-PBGA-B575

3

2.6 mm

31 mm

No

e0

650 MHz

392

225 °C (437 °F)

31 mm

XC2V1500-4FF896I

Xilinx

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

17280

Yes

1.575 V

1920

CMOS

528

1500000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

1920 CLBS, 1500000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B896

4

3.4 mm

31 mm

No

e0

650 MHz

30 s

528

225 °C (437 °F)

31 mm

XC2V1500-4FG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

17280

Yes

1.575 V

1920

CMOS

392

1500000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

1920 CLBS, 1500000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

3

2.6 mm

27 mm

No

e0

650 MHz

30 s

392

225 °C (437 °F)

27 mm

XC2V1500-5BG575I

Xilinx

FPGA

Ball

575

BGA

Square

Plastic/Epoxy

17280

Yes

1.575 V

1920

CMOS

392

1500000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA575,24X24,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.39 ns

1920 CLBS, 1500000 Gates

Tin Lead

Bottom

S-PBGA-B575

3

2.6 mm

31 mm

No

e0

750 MHz

392

225 °C (437 °F)

31 mm

XC2V1500-5FF896I

Xilinx

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

17280

Yes

1.575 V

1920

CMOS

528

1500000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

1920 CLBS, 1500000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B896

4

3.4 mm

31 mm

No

e0

750 MHz

30 s

528

225 °C (437 °F)

31 mm

XC2V1500-5FG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

17280

Yes

1.575 V

1920

CMOS

392

1500000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

1920 CLBS, 1500000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

3

2.6 mm

27 mm

No

e0

750 MHz

30 s

392

225 °C (437 °F)

27 mm

XC2V2000-4BF957I

Xilinx

FPGA

Ball

957

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

624

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA957,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

2688 CLBS, 2000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B957

4

3.5 mm

40 mm

No

e0

650 MHz

30 s

624

225 °C (437 °F)

40 mm

XC2V2000-4BG575I

Xilinx

FPGA

Ball

575

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

408

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA575,24X24,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

2688 CLBS, 2000000 Gates

Tin Lead

Bottom

S-PBGA-B575

3

2.6 mm

31 mm

No

e0

650 MHz

408

225 °C (437 °F)

31 mm

XC2V2000-4FF896I

Xilinx

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

624

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

2688 CLBS, 2000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B896

4

3.4 mm

31 mm

No

e0

650 MHz

30 s

624

225 °C (437 °F)

31 mm

XC2V2000-4FG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

456

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

2688 CLBS, 2000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

3

2.6 mm

27 mm

No

e0

650 MHz

30 s

456

225 °C (437 °F)

27 mm

XC2V2000-5BG575I

Xilinx

FPGA

Ball

575

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

408

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA575,24X24,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.39 ns

2688 CLBS, 2000000 Gates

Tin Lead

Bottom

S-PBGA-B575

3

2.6 mm

31 mm

No

e0

750 MHz

408

225 °C (437 °F)

31 mm

XC2V2000-5FF896I

Xilinx

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

624

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

2688 CLBS, 2000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B896

4

3.4 mm

31 mm

No

e0

750 MHz

30 s

624

225 °C (437 °F)

31 mm

XC2V2000-5FG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

24192

Yes

1.575 V

2688

CMOS

456

2000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

2688 CLBS, 2000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

3

2.6 mm

27 mm

No

e0

750 MHz

30 s

456

225 °C (437 °F)

27 mm

XC2V250-4FG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

172

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

384 CLBS, 250000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

650 MHz

30 s

172

225 °C (437 °F)

17 mm

XC2V250-4FG456I

Xilinx

FPGA

Ball

456

BGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

200

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA456,22X22,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

384 CLBS, 250000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B456

3

2.6 mm

23 mm

No

e0

650 MHz

30 s

200

225 °C (437 °F)

23 mm

XC2V250-5FG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

172

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

384 CLBS, 250000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

750 MHz

30 s

172

225 °C (437 °F)

17 mm

XC2V250-5FG456I

Xilinx

FPGA

Ball

456

BGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

200

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA456,22X22,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

384 CLBS, 250000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B456

3

2.6 mm

23 mm

No

e0

750 MHz

30 s

200

225 °C (437 °F)

23 mm

XC2V250-6FG256C

Xilinx

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

3456

Yes

1.575 V

384

CMOS

172

250000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

0.35 ns

384 CLBS, 250000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

820 MHz

30 s

172

225 °C (437 °F)

17 mm

XC2V3000-4BF957C

Xilinx

FPGA

Other

Ball

957

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

684

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA957,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

0.44 ns

3584 CLBS, 3000000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B957

4

3.5 mm

40 mm

No

e0

650 MHz

30 s

684

225 °C (437 °F)

40 mm

XC2V3000-4BF957I

Xilinx

FPGA

Ball

957

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

684

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA957,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

3584 CLBS, 3000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B957

4

3.5 mm

40 mm

No

e0

650 MHz

30 s

684

225 °C (437 °F)

40 mm

XC2V3000-4BG728I

Xilinx

FPGA

Ball

728

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

516

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA728,27X27,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

3584 CLBS, 3000000 Gates

Tin Lead

Bottom

S-PBGA-B728

3

2.6 mm

35 mm

No

e0

650 MHz

516

35 mm

XC2V3000-4FF1152I

Xilinx

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

720

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

3584 CLBS, 3000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B1152

4

3.4 mm

35 mm

No

e0

650 MHz

30 s

720

225 °C (437 °F)

35 mm

XC2V3000-4FG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

484

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

3584 CLBS, 3000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

3

2.6 mm

27 mm

No

e0

650 MHz

30 s

484

225 °C (437 °F)

27 mm

XC2V3000-5BF957I

Xilinx

FPGA

Ball

957

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

684

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA957,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.39 ns

3584 CLBS, 3000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B957

4

3.5 mm

40 mm

No

e0

750 MHz

30 s

684

225 °C (437 °F)

40 mm

XC2V3000-5BG728I

Xilinx

FPGA

Ball

728

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

516

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA728,27X27,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.39 ns

3584 CLBS, 3000000 Gates

Tin Lead

Bottom

S-PBGA-B728

3

2.6 mm

35 mm

No

e0

750 MHz

516

35 mm

XC2V3000-5FF1152I

Xilinx

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

720

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

3584 CLBS, 3000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B1152

4

3.4 mm

35 mm

No

e0

750 MHz

30 s

720

225 °C (437 °F)

35 mm

XC2V3000-5FG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

32256

Yes

1.575 V

3584

CMOS

484

3000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

3584 CLBS, 3000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B676

3

2.6 mm

27 mm

No

e0

750 MHz

30 s

484

225 °C (437 °F)

27 mm

XC2V40-4FG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

64 CLBS, 40000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

650 MHz

30 s

88

225 °C (437 °F)

17 mm

XC2V40-5FG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.39 ns

64 CLBS, 40000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

750 MHz

30 s

88

225 °C (437 °F)

17 mm

XC2V4000-4BF957I

Xilinx

FPGA

Ball

957

BGA

Square

Plastic/Epoxy

51840

Yes

1.575 V

5760

CMOS

684

4000000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA957,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

0.44 ns

5760 CLBS, 4000000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B957

4

3.5 mm

40 mm

No

e0

650 MHz

30 s

684

225 °C (437 °F)

40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.