BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP70-5FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	8272 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	964	225 °C (437 °F)	40 mm
XC2VP70-5FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1050 MHz	30 s	964	225 °C (437 °F)	40 mm
XC2VP70-5FF1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	8272 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1050 MHz	30 s	996	225 °C (437 °F)	42.5 mm
XC2VP70-5FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1050 MHz	30 s	996	225 °C (437 °F)	42.5 mm
XC2VP70-6FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	8272 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	964	225 °C (437 °F)	40 mm
XC2VP70-6FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1200 MHz	30 s	964	225 °C (437 °F)	40 mm
XC2VP70-6FF1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	8272 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1200 MHz	30 s	996	225 °C (437 °F)	42.5 mm
XC2VP70-6FF1704I	Xilinx	FPGA		Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	8272 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1200 MHz	30 s	996	225 °C (437 °F)	42.5 mm
XC2VP70-7FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	8272 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	1350 MHz	30 s	964	225 °C (437 °F)	40 mm
XC2VP70-7FF1704C	Xilinx	FPGA	Other	Ball	1704	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	996		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1704,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	8272 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1704	4	3.45 mm	42.5 mm	No		e0	1350 MHz	30 s	996	225 °C (437 °F)	42.5 mm
XC2S400E-6FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	410	145000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 400000	e0	357 MHz	30 s	410	240 °C (464 °F)	17 mm
OR4E02-1BA352C	Lattice Semiconductor	FPGA	Commercial	Ball	352	BGA	Square	Plastic/Epoxy	4992	Yes	1.575 V	624	CMOS	262	201000	1.5	1.5/3.3 V	Grid Array	BGA352,26X26,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	70 °C (158 °F)	1.1 ns	624 CLBS, 201000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B352	3	2.54 mm	35 mm	No	Maximum no of usable gates is 397000		420 MHz	30 s	262	225 °C (437 °F)	35 mm
XC3S1000-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1000-4FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.61 ns	1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1000-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		391		27 mm
XC3S1000-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	1920 CLBS, 1000000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		391		27 mm
XC3S1000-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	725 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1000-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	725 MHz		391		27 mm
XC3S1500-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1500-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1500-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		487		27 mm
XC3S1500-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		487		27 mm
XC3S1500-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	725 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1500-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	725 MHz		487		27 mm
XC3S2000-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS	489	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		489		27 mm
XC3S2000-4FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS	489	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.61 ns	5120 CLBS, 2000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	630 MHz		489		27 mm
XC3S2000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS	565	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	565	225 °C (437 °F)	31 mm
XC3S400-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	264	225 °C (437 °F)	23 mm
XC3S400-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	896 CLBS, 400000 Gates		Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	264	225 °C (437 °F)	23 mm
XC3S400-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	725 MHz	30 s	264	225 °C (437 °F)	23 mm
XC3S4000-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XC3S4000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XC3S5000-4FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	784	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e0	630 MHz		784	225 °C (437 °F)	35 mm
XC3S5000-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XC3S5000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	8320 CLBS, 5000000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XC3S5000-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	725 MHz	30 s	633	225 °C (437 °F)	31 mm
XC2VP20-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	404	225 °C (437 °F)	27 mm
XC2VP20-5FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.36 ns	2320 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	404	225 °C (437 °F)	27 mm
XC2VP20-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	404	225 °C (437 °F)	27 mm
XC2VP20-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.32 ns	2320 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	404	225 °C (437 °F)	27 mm
XC2VP20-7FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1350 MHz	30 s	404	225 °C (437 °F)	27 mm
XC2VP30-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP30-5FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.36 ns	3424 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP30-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP30-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.32 ns	3424 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP40-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP40-5FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.36 ns	4848 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC2VP40-6FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.