BGA Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7K325T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC7K325T-L2FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K355T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	27825				.95		Grid Array			.93 V	1 mm		0.61 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K410T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC7K410T-L2FFG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC7K410T-L2FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K480T-L2FFG901I	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.97 V	37325				.95		Grid Array			.93 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7V2000T-L2FHG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS		850	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm	No		e1	1818 MHz		850		45 mm
XC7A200T-2FB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825				1		Grid Array			.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e0		30 s		225 °C (437 °F)	27 mm
ICE40UL1K-SWG16ITR	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy	1248	Yes	1.26 V	156	CMOS		10	1.2		Grid Array			1.14 V	.35 mm	100 °C (212 °F)	9 ns	156 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B16	1		1.409 mm					30 s	10	260 °C (500 °F)	1.409 mm
ICE40UL640-SWG16ITR	Lattice Semiconductor	FPGA	Industrial	Ball	16	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS		10	1.2		Grid Array			1.14 V	.35 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B16	1		1.409 mm					30 s	10	260 °C (500 °F)	1.409 mm
XC7A200T-2FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825				1		Grid Array			.95 V	1 mm		1.05 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC7A200T-L2FBV484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	.93 V	16825				.9		Grid Array			.87 V	1 mm		1.51 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm			e1		30 s		250 °C (482 °F)	23 mm
XC7K325T-1FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC7K325T-2FFV900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC7K355T-L2FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V	27825				.9		Grid Array			.87 V	1 mm		0.91 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K410T-1FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm		0.74 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC7K410T-2FBV676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC7K410T-2FFV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC7K420T-L2FFV901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy		Yes	.93 V	32575				.9		Grid Array			.87 V	1 mm		0.91 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K480T-2FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm			e1					35 mm
XC7K70T-1FBV484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	5125				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.54 mm	23 mm			e1					23 mm
XC7VX330T-2FFV1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25500				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.77 mm	42.5 mm			e1					42.5 mm
XC7VX415T-2FFV1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158		3.35 mm	35 mm			e1					35 mm
XA7A75T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG		285	1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XA7A75T-1FGG484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG	AEC-Q100	285	1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	125 °C (257 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XA7A75T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900	HKMG		285	1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XA7A100T-1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG		285	1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	23 mm
XA7A100T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG		285	1	1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC5VSX35T-1FFG665CES	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy		Yes	1.05 V	2720	CMOS			1		Grid Array			.95 V	1 mm	85 °C (185 °F)		2720 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1	1098 MHz	30 s		250 °C (482 °F)	27 mm
LCMXO3L-9400C-5BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5		Grid Array			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply						19 mm
LCMXO3LF-9400C-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5		Grid Array			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply						19 mm
LCMXO3LF-9400C-6BG484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			384	2.5		Grid Array			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply				384		19 mm
XCKU095-2FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702	0.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm	No		e1		30 s	702	245 °C (473 °F)	47.5 mm
XCKU085-1FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU085-1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
XCKU095-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	702	245 °C (473 °F)	40 mm
XCKU085-2FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCKU085-1FLVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
XCKU085-2FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCKU085-1FLVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU095-1FFVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU085-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU085-1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCKU095-2FFVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU095-1FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XCKU085-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190			676	0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1			676		42.5 mm
XCKU085-3FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676	1	1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.