BGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA6SLX75-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	280		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No	e1	62.5 MHz	30 s	280	250 °C (482 °F)
XA6SLX75T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		AEC-Q100; TS 16949	268	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	268	250 °C (482 °F)	23 mm
XA6SLX75T-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	268		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No	e1	62.5 MHz	30 s	268	250 °C (482 °F)
XA6SLX75T-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	268		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No	e1	62.5 MHz	30 s	268	250 °C (482 °F)
XC7V2000T-1FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS		1200	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No	e1	1818 MHz		1200		45 mm
XC7V2000T-2FHG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS		850	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm	No	e1	1818 MHz		850		45 mm
XC7V2000T-2FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS		1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No	e1	1818 MHz		1200		45 mm
XC7VX1140T-1FLG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS		1100	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz		1100		45 mm
XC7VX1140T-1FLG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS		1100	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	89000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz		1100		45 mm
XC7VX1140T-2FLG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS		1100	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No	e1	1818 MHz		1100		45 mm
XC7VX330T-1FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		600	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-1FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-1FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		650	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No	e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XC7VX330T-2FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-2FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-2FFG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		650	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No	e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XC7VX330T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		650	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No	e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XC7VX330T-3FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX330T-3FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS		650	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	25500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No	e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XC7VX415T-1FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX415T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX415T-2FFG1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX415T-2FFG1157I	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX415T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX415T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX415T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX415T-2FFG1927I	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	32200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX415T-3FFG1157E	Xilinx	FPGA		Ball	1157	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	CMOS		600	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX485T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		350	1	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-1FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-1FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX485T-1FFG1927I	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX485T-1FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		700	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz		700		45 mm
XC7VX485T-1FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz		700		45 mm
XC7VX485T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX485T-2FFG1927I	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX485T-2FFG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz		700		45 mm
XC7VX485T-2FFG1930I	Xilinx	FPGA		Ball	1930	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		700	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No	e1	1818 MHz		700		45 mm
XC7VX485T-3FFG1158E	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX485T-3FFG1927E	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX550T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		350	1	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX550T-1FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		600	1	0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX550T-1FFG1927I	Xilinx	FPGA		Ball	1927	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	43300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm
XC7VX550T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX550T-2FFG1158I	Xilinx	FPGA		Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		350	1	1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	43300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No	e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX550T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS		600	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No	e1	1818 MHz		600	245 °C (473 °F)	45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.