FPGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV1600E-6BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV1600E-6FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0	357 MHz	30 s	700	225 °C (437 °F)	31 mm
XCV1600E-6FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0	357 MHz	30 s	700	225 °C (437 °F)	31 mm
XCV1600E-7BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV1600E-7FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	400 MHz		724		35 mm
XCV1600E-7FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-6BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV2000E-6BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV2000E-6FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	357 MHz		804		35 mm
XCV2000E-6FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	357 MHz		804		35 mm
XCV2000E-6FG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	357 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV2000E-6FG680I	Xilinx	FPGA		Ball	680	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	512	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No	e0	357 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV2000E-6FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-7BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV2000E-7BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV2000E-7FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	400 MHz		804		35 mm
XCV2000E-7FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	400 MHz		804		35 mm
XCV2000E-7FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV200E-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200E-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200E-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	357 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV200E-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	357 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV200E-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	158	63504	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	357 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV200E-6PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	158	63504	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm		0.47 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	357 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV200E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200E-7FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200E-7FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	284	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	400 MHz	30 s	284	225 °C (437 °F)	23 mm
XCV200E-7PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	158	63504	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	400 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV200E-7PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	158	63504	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm		0.42 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	400 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV2600E-6FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	12696	CMOS	804	685584	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	12696 CLBS, 685584 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No		357 MHz		804		35 mm
XCV2600E-7FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	12696	CMOS	804	685584	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	12696 CLBS, 685584 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No		400 MHz		804		35 mm
XCV300E-6BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	357 MHz	30 s	316	225 °C (437 °F)	40 mm
XCV300E-6BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	357 MHz	30 s	316	225 °C (437 °F)	40 mm
XCV300E-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV300E-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV300E-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	357 MHz	30 s	312	225 °C (437 °F)	23 mm
XCV300E-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	357 MHz	30 s	312	225 °C (437 °F)	23 mm
XCV300E-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	158	82944	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	357 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV300E-6PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	158	82944	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	357 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV300E-7BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	400 MHz	30 s	316	225 °C (437 °F)	40 mm
XCV300E-7BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	400 MHz	30 s	316	225 °C (437 °F)	40 mm
XCV300E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV300E-7FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV300E-7FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	400 MHz	30 s	312	225 °C (437 °F)	23 mm
XCV300E-7FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	312	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	400 MHz	30 s	312	225 °C (437 °F)	23 mm
XCV300E-7PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	158	82944	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	400 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV300E-7PQ240I	Xilinx	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	158	82944	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	400 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV400E-6BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	316	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	e0	357 MHz	30 s	316	225 °C (437 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.