FPGA Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VSX315T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VSX315T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VSX315T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VSX315T-2FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VSX315T-2FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VSX315T-L1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	.93 V		CMOS		720	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC6VSX475T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VSX475T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VSX475T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VSX475T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC6VSX475T-2FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1286 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VSX475T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		600	1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VSX475T-2FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		840	1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e1	1286 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC6VSX475T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS		600	.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VSX475T-L1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS		840	.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No	e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XA2S100E-6TQ144I	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	AEC-Q100	102	1.8	1.2/3.6,1.8 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm			600 CLBS		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3			No	e0	357 MHz	30 s	102	225 °C (437 °F)
XA2S100E-6TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	AEC-Q100	102	1.8	1.2/3.6,1.8 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		600 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3			No	e0	357 MHz	30 s	102	225 °C (437 °F)
XA2S150E-6FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	AEC-Q100	182	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm			864 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No	e0	357 MHz	30 s	182	240 °C (464 °F)
XA2S150E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS	AEC-Q100	182	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		864 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No	e0	357 MHz	30 s	182	240 °C (464 °F)
XA2S200E-6FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	AEC-Q100	182	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm			1176 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No	e0	357 MHz	30 s	182	240 °C (464 °F)
XA2S200E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	AEC-Q100	182	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		1176 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No	e0	357 MHz	30 s	182	240 °C (464 °F)
XA2S300E-6FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	AEC-Q100	182	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm			1536 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No	e0	357 MHz	30 s	182	240 °C (464 °F)
XA2S300E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	AEC-Q100	182	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		1536 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No	e0	357 MHz	30 s	182	240 °C (464 °F)
XA2S50E-6TQ144I	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	AEC-Q100	102	1.8	1.2/3.6,1.8 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm			384 CLBS		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3			No	e0	357 MHz	30 s	102	225 °C (437 °F)
XA2S50E-6TQ144Q	Xilinx	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	AEC-Q100	102	1.8	1.2/3.6,1.8 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	125 °C (257 °F)		384 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3			No	e0	357 MHz	30 s	102	225 °C (437 °F)
XC6SLX100-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		320	1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	667 MHz	30 s	320	260 °C (500 °F)	19 mm
XC6SLX100-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		320	1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	667 MHz	30 s	320	260 °C (500 °F)	19 mm
XC6SLX100-2FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-2FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	667 MHz	30 s	480	225 °C (437 °F)	27 mm
XC6SLX100-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	667 MHz	30 s	480	225 °C (437 °F)	27 mm
XC6SLX100-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX100-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX100-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	480	250 °C (482 °F)	27 mm
XC6SLX100-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	480	250 °C (482 °F)	27 mm
XC6SLX100-3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		320	1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	862 MHz	30 s	320	260 °C (500 °F)	19 mm
XC6SLX100-3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		338	1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1	862 MHz	30 s	338	260 °C (500 °F)	19 mm
XC6SLX100-3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	862 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	862 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6SLX100-3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	862 MHz	30 s	480	225 °C (437 °F)	27 mm
XC6SLX100-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	862 MHz	30 s	480	225 °C (437 °F)	27 mm
XC6SLX100-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX100-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	862 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX100-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	862 MHz	30 s	480	250 °C (482 °F)	27 mm
XC6SLX100-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	862 MHz	30 s	480	250 °C (482 °F)	27 mm
XC6SLX100-L1CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS		338	1	1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	0.46 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1			338		19 mm
XC6SLX100-L1CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS		320	1	1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No	e1			320		19 mm
XC6SLX100-L1FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS		326	1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0		30 s	326	225 °C (437 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.