Microchip Technology Field Programmable Gate Arrays (FPGA) 84

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Part	Manufacturer	Programmable IC Type	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	No. of Outputs	Length
MPF500T-FCG1152E	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V	CMOS	584		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	584	35 mm
MPF500T-FCG1152I	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V	CMOS	584		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	584	35 mm
MPF500TLS-FCG1152I	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V	CMOS	584		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	584	35 mm
MPF500TS-FCG1152I	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V	CMOS	584		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	584	35 mm
A3P1000-FGG256M	Microchip Technology	FPGA	Ball	256	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	CMOS	177	1000000	1.5	Grid Array, Low Profile	BGA256,16X16,40	1.425 V	1 mm	125 °C (257 °F)	1000000 Gates	-55 °C (-67 °F)	Bottom	S-PBGA-B256	1.7 mm	17 mm		177	17 mm
A3P1000-FGG484M	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	CMOS	300	1000000	1.5	Grid Array	BGA484,22X22,40	1.425 V	1 mm	125 °C (257 °F)	1000000 Gates	-55 °C (-67 °F)	Bottom	S-PBGA-B484	2.44 mm	23 mm		300	23 mm
MPF100T-1FCG484E	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100T-1FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100T-1FCSG325E	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100T-1FCSG325I	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100T-1FCVG484E	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF100T-FCG484E	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100T-FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100T-FCSG325I	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100T-FCVG484E	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF100TL-FCG484E	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100TL-FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100TL-FCSG325E	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100TL-FCSG325I	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100TL-FCVG484E	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF100TL-FCVG484I	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF100TLS-FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100TLS-FCSG325I	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100TLS-FCVG484I	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF100TS-1FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100TS-1FCVG484I	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF100TS-FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF100TS-FCSG325I	Microchip Technology	FPGA	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	170		1	Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply	170	11 mm
MPF100TS-FCVG484I	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF200T-1FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF200T-1FCG784I	Microchip Technology	FPGA	Ball	784	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V	CMOS	364		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply	364	29 mm
MPF200T-FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF200T-FCVG484I	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy	192000	Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF200TS-1FCSG536I	Microchip Technology	FPGA	Ball	536	LFBGA	Square	Plastic/Epoxy	192000	Yes	1.03 V	CMOS	300		1	Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B536	1.45 mm	16 mm	It also Operates at 1.05 V nominal supply	300	16 mm
MPF300T-1FCG1152I	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300T-1FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF300T-1FCG784E	Microchip Technology	FPGA	Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply	388	29 mm
MPF300T-1FCG784NI	Microchip Technology	FPGA	Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply	388	29 mm
MPF300T-1FCSG536I	Microchip Technology	FPGA	Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	300		1	Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B536	1.45 mm	16 mm	It also Operates at 1.05 V nominal supply	300	16 mm
MPF300T-1FCVG484E	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF300T-1FCVG484I	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF300T-FCG1152E	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300T-FCG484E	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm
MPF300T-FCG784NI	Microchip Technology	FPGA	Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	388		1	Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply	388	29 mm
MPF300T-FCVG484E	Microchip Technology	FPGA	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	284		1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply	284	19 mm
MPF300TL-FCG1152E	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300TL-FCG1152I	Microchip Technology	FPGA	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	512		1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300TL-FCG484I	Microchip Technology	FPGA	Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V	CMOS	244		1	Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply	244	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.