Microchip Technology Field Programmable Gate Arrays (FPGA) 84

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	JESD-609 Code	No. of Outputs	Peak Reflow Temperature (C)	Length
MPF300TL-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF300TL-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284		19 mm
MPF300TL-FCVG484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284		19 mm
MPF300TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1		Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply		512		35 mm
MPF300TLS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1		Grid Array	BGA484,22X22,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply		244		23 mm
MPF300TLS-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF300TLS-FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	300		1		Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20	.97 V	.5 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B536	1.45 mm	16 mm	It also Operates at 1.05 V nominal supply		300		16 mm
MPF300TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1		Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply		512		35 mm
MPF300TS-1FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF300TS-FCG784NI	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500T-1FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500T-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500T-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500TL-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500TLS-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500TS-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500TS-FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF100T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284		19 mm
MPF300TS-FC484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1		Grid Array	BGA484,22X22,40	.97 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	S-PBGA-B484	3.39 mm	23 mm	It also Operates at 1.05 V nominal supply		284		23 mm
MPF300TS-FCV484M	Microchip Technology	FPGA	Military	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284		19 mm
MPF200TS-FCS325M	Microchip Technology	FPGA	Military	Ball	325	LFBGA	Rectangular	Plastic/Epoxy	192000	Yes	1.03 V		CMOS	170		1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	R-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply		170		14.5 mm
MPF300TS-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284	260 °C (500 °F)	19 mm
MPF300TS-FCS536M	Microchip Technology	FPGA	Military	Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	300		1		Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20	.97 V	.5 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	S-PBGA-B536	1.45 mm	16 mm	It also Operates at 1.05 V nominal supply		300		16 mm
MPF500TS-FC784M	Microchip Technology	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF100T-1FCG484T2	Microchip Technology	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS	284		1		Grid Array	BGA484,22X22,40	.97 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	2.87 mm	23 mm	It also Operates at 1.05 V nominal supply		284		23 mm
MPF100T-FCSG325E	Microchip Technology	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	170		1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply		170		11 mm
MPF300T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284		19 mm
MPF100T-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS	284		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		284		19 mm
AX2000-1CGS624M	Microchip Technology	FPGA	Military		624	CGA	Square	Ceramic, Metal-Sealed Cofired	32526	Yes	1.575 V	21504	CMOS	418	2000000	1.5	Box	Grid Array		1.425 V		125 °C (257 °F)	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-X624			1060000 typical gates avaialable		418
MPF300T-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1		Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply		512		35 mm
MPF300T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
MPF500T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1		Grid Array	BGA784,28X28,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B784	3.47 mm	29 mm	It also Operates at 1.05 V nominal supply		388		29 mm
M2S150TS-1FCV484M	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	146124	Yes	1.26 V			248		1.2		Grid Array, Fine Pitch	BGA484,22X22,32	1.14 V	.8 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3.15 mm	19 mm		e0	248		19 mm
MPF050T-1FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS	164		1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply		164		11 mm
MPF050T-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS	176		1		Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484	3.32 mm	19 mm	It also Operates at 1.05 V nominal supply		176		19 mm
MPF050T-FCSG325E	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS	164		1		Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20	.97 V	.5 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B325	1.45 mm	11 mm	It also Operates at 1.05 V nominal supply		164		11 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.