Ball Programmable Logic Devices (PLD) 278

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
LCMXO2-640HC-4MG132C	Lattice Semiconductor	Flash PLD	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	7.24 ns		Yes	3.462 V			79	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays		Mixed	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also operates at 3.3 V nominal supply	e1		30 s	79	250 °C (482 °F)	8 mm		80
XC9536-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	36	CMOS		5		3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s		240 °C (464 °F)	7 mm	Yes	34
XC95144XL-7CS144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	144	CMOS	117	3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e0	107.52 MHz	30 s	117	240 °C (464 °F)	12 mm	Yes	117
XC9536XL-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	36	CMOS	36	3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	36 Macrocells	e0	178.6 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC9536XL-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	36	3.3		2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	36 Macrocells	e0	125 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
EPF10K100BFC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V		CMOS	191	2.5		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm		191
EPF10K100BFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V		CMOS	191	2.5		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm		191
EPF10K10AFC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	150	3.3		2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	17 mm		150
EPF10K50SFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS	254	2.5		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254	220 °C (428 °F)	23 mm		254
XC95288XL-10BG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192	3.3		2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC95288XL-10BG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192	3.3		2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC95288XL-7BG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS	192	3.3		2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC95288XL-10CS280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192	3.3		2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	100 MHz	30 s	192	240 °C (464 °F)	16 mm	Yes	192
EPF6024ABI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	218	3.3		2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	3 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin/Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz	30 s	218	220 °C (428 °F)	27 mm		218
EPF10K30ABI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V		CMOS	246	3.3		2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz		246	220 °C (428 °F)	35 mm		246
EPF10K130VBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	3.6 V		CMOS	470	3.3		3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K130VBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.7 ns	6656	Yes	3.6 V		CMOS	470	3.3		3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K130VBC600-4	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.9 ns	6656	Yes	3.6 V		CMOS	470	3.3		3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K250ABC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns	12160	Yes	3.6 V		CMOS	470	3.3		2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	45 mm		470
EPM9320ABC356-10	Altera	EE PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	10.8 ns		Yes	5.25 V	320	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	144.9 MHz			220 °C (428 °F)	35 mm	Yes	168
EPM9320BC356-15	Altera	EE PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns		Yes	5.25 V	320	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	35 mm	Yes	168
EP20K200EBC652-1	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V		CMOS	368	1.8		1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			368	220 °C (428 °F)	45 mm		376
EP20K200EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.33 ns	8320	Yes	1.89 V		CMOS	368	1.8		1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			368	220 °C (428 °F)	45 mm		376
EP20K400BI652-2	Altera	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS	496	2.5		2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 502 I/O	4		Tin Lead	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e0			496	220 °C (428 °F)	45 mm		502
EPM7128AFC100-10	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3		2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	87 MHz			220 °C (428 °F)	11 mm	Yes	84
EPM7128AFC100-6	Altera	EE PLD	Commercial	Ball	100	LBGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	128	CMOS		3.3		2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 84 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	144.9 MHz			220 °C (428 °F)	11 mm	Yes	84
EPM7256AFC256-12	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	78.1 MHz			220 °C (428 °F)	17 mm	Yes	164
EPM7256AFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS		3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	125 MHz			220 °C (428 °F)	17 mm	Yes	164
EPF6024AFI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	219	3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm		4 Dedicated Inputs, 219 I/O	4		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	153 MHz		219	220 °C (428 °F)	17 mm		219
XC95216-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	216	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-10BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	216	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	66.7 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-15BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	216	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-15BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	216	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-20BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	216	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 166 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95216-20BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.5 V	216	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	166
XC95288-10BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	288	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC95288-15BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.25 V	288	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC95288-15BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	288	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC95288-20BG352C	Xilinx	Flash PLD	Commercial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	288	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC95288-20BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns		Yes	5.5 V	288	CMOS		5		3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC9536-10CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	36	CMOS		5		3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	66.7 MHz	30 s		240 °C (464 °F)	7 mm	Yes	34
XC9536-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V	36	CMOS		5		3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	83.3 MHz	30 s		240 °C (464 °F)	7 mm	Yes	34
CY37512P256-100BGI	Cypress Semiconductor	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	512	CMOS		5		3.3/5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 197 I/O	1	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.46 mm	27 mm	No	512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V	e0	80 MHz				27 mm	Yes	197
CY37512VP256-83BGC	Cypress Semiconductor	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	512	CMOS		3.3		3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 197 I/O	1	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.46 mm	27 mm	No	512 Macrocells	e0	62.5 MHz				27 mm	Yes	197
XCR3256XL-10CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS		3.3		3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	16 mm	Yes	164
EP20K100FC324-1V	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS	246	2.5		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	100 MHz		246	220 °C (428 °F)	19 mm		252
EP20K100FC324-3V	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.6 ns	4160	Yes	2.625 V		CMOS	246	2.5		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1			246	220 °C (428 °F)	19 mm		252
EP20K200FC484-3V	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	3.6 ns	8320	Yes	2.625 V		CMOS	376	2.5		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1			376	220 °C (428 °F)	23 mm		382

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.