Ball Programmable Logic Devices (PLD) 278

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EP20K300EBC652-1	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.68 ns	11520	Yes	1.89 V		CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm		408
EP20K300EBC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V		CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm		408
EP20K300EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.06 ns	11520	Yes	1.89 V		CMOS	400	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm		408
EP20K30EFC324-1	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.91 ns	1200	Yes	1.89 V		CMOS	120	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EP20K30EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns	1200	Yes	1.89 V		CMOS	120	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EP20K400BC652-1V	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	100 MHz		496	220 °C (428 °F)	45 mm		502
EP20K400BC652-2V	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e1	34 MHz		496	220 °C (428 °F)	45 mm		502
XC9536XL-10CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS	36	3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC9536XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS	36	3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC9572XL-10CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	38	3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	100 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XC9572XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	38	3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	100 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XCR3128XL-10CS144C	Xilinx	EE PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 108 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XCR3128XL-10CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XCR3064XL-10CP56C	Xilinx	EE PLD	Commercial	Ball	56	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 48 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	6 mm	Yes	48
XCR3064XL-10CP56I	Xilinx	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	3/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 48 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	6 mm	Yes	48
XCR3064XL-7CP56I	Xilinx	EE PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS		3.3	3/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 48 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	6 mm	Yes	48
XCR3064XL-10CS48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
XCR3064XL-10CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
XCR3064XL-7CS48C	Xilinx	EE PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS		3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 40 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
XCR3064XL-7CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	64	CMOS		3.3	3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 40 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	40
CY39200V388-125MGC	Cypress Semiconductor	Loadable PLD	Commercial	Ball	388	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.7 V	3072	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA388,26X26,50	Programmable Logic Devices	Yes	Macrocell	2.3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 294 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B388		2.46 mm	35 mm	No	Also operates at 3.3 V nominal supply	e0					35 mm	Yes	294
XCR3032XL-10CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	32	CMOS		3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
XCR3032XL-7CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	32	CMOS		3.3	3/3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	7 mm	Yes	36
EPM7032BUC49-3	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	32	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	303 MHz			220 °C (428 °F)	7 mm	Yes	36
EPM7032BUC49-7	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	32	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	303 MHz			220 °C (428 °F)	7 mm	Yes	36
EPM7128AEUC169-10	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	98 MHz			220 °C (428 °F)	11 mm	Yes	100
EPM7128AEUC169-5	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	192.3 MHz			220 °C (428 °F)	11 mm	Yes	100
EPM7128AEUC169-7	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	129.9 MHz			220 °C (428 °F)	11 mm	Yes	100
EPM7128BUC169-10	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	94.3 MHz			220 °C (428 °F)	11 mm	Yes	100
EPM7128BUC169-4	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	243.9 MHz			220 °C (428 °F)	11 mm	Yes	100
EPM7128BUC169-7	Altera	EE PLD	Commercial	Ball	169	LFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169		1.55 mm	11 mm	No		e0	126.6 MHz			220 °C (428 °F)	11 mm	Yes	100
EPM7128BUC49-10	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	94.3 MHz			220 °C (428 °F)	7 mm	Yes	41
EPM7128BUC49-4	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No		e0	243.9 MHz			220 °C (428 °F)	7 mm	Yes	41
ISPLSI5384VE-100LF256I	Lattice Semiconductor	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	384	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XC95288XL-10FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XC95288XL-10FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XC95288XL-7FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS	192	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XC95288XV-10CS280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns		Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	100 MHz	30 s		240 °C (464 °F)	16 mm	Yes	192
XC95288XV-10FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XC95288XV-10FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	100 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XC95288XV-7CS280C	Xilinx	Flash PLD	Commercial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	16 mm	Yes	192
XC95288XV-7FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XC9572XV-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns		Yes	2.62 V	72	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	222 MHz	30 s		240 °C (464 °F)	7 mm	Yes	38
XC9572XV-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.62 V	72	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 38 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	7 mm	Yes	38
XC9536XV-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns		Yes	2.62 V	36	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC9536XV-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	2.62 V	36	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XCR3128XL-7CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS		3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XCR3384XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS		3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	102 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.