Commercial Programmable Logic Devices (PLD) 592

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPX740LC44-10Z	Altera	OT PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	40	Yes	5.25 V		CMOS	32		5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 30 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	4 Labs; 40 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	71.4 MHz		32	220 °C (428 °F)	16.5862 mm		30
EPX780QC132-15Z	Altera	OT PLD	Commercial	Gull Wing	132	BQFP	Square	Plastic/Epoxy	18 ns	80	Yes	5.25 V		CMOS	104		5	5 V	Flatpack, Bumper	SPQFP132,1.1SQ	Field Programmable Gate Arrays		Macrocell	4.75 V		.635 mm	70 °C (158 °F)	22 Dedicated Inputs, 80 I/O	22	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G132	3	4.57 mm	24.13 mm	No	8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V	e0	50 MHz		104	220 °C (428 °F)	24.13 mm		80
EPS448LC-20	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy			Yes	5.25 V		CMOS			5		Chip Carrier				Registered	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	Stand-Alone Microsequencer	e0	20 MHz			220 °C (428 °F)	11.5062 mm		0
EPS448JC-25	Altera	UV PLD	Commercial	J Bend	28	WQCCJ	Square	Ceramic, Metal-Sealed Cofired			Yes	5.25 V		CMOS			5		Chip Carrier, Window				Registered	4.75 V		1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)	Tin Lead	Quad	S-CQCC-J28		4.826 mm	11.43 mm	No	Stand-Alone Microsequencer	e0	25 MHz			220 °C (428 °F)	11.43 mm		0
EPF81188ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V		CMOS	184		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		180	220 °C (428 °F)	32 mm		184
EPF81188ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V		CMOS	184		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		180	220 °C (428 °F)	32 mm		184
EPF81188ARC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V		CMOS	184		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		180	220 °C (428 °F)	32 mm		184
EPF81500ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.7 ns	1296	Yes	5.25 V		CMOS	181		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		177	220 °C (428 °F)	32 mm		181
EPF81500ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1296	Yes	5.25 V		CMOS	181		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		177	220 °C (428 °F)	32 mm		181
EPF8282AVTC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V		CMOS	78		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e0	385 MHz		74	220 °C (428 °F)	14 mm		78
EPF8820ARC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		148	220 °C (428 °F)	28 mm		152
EPF8820ARC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	28 mm		152
EPF8820ARC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS	152		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		148	220 °C (428 °F)	28 mm		152
TIBPALR19R4CFN	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		TTL	19	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 4 I/O	0	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	1 External Clock; Register Preload		30 MHz		8		11.5062 mm		4
TIBPALT19R4CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		TTL	19	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 4 I/O	0	0 °C (32 °F)		Dual	R-PDIP-T24				No	1 External Clock; Register Preload		30 MHz		8				4
TIBPALT19R6CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		TTL	19	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 2 I/O	0	0 °C (32 °F)		Dual	R-PDIP-T24				No	1 External Clock; Register Preload		30 MHz		8				2
TIFPLA839CFN	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		TTL	14	PLA-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	32	1.27 mm	70 °C (158 °F)	14 Dedicated Inputs, 0 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					6		11.5062 mm		0
EPF8452AGC160-3	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired		336	No	5.25 V		CMOS	120		5	3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays		Registered	4.75 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	336 Logic Elements	e0	385 MHz		116	220 °C (428 °F)	39.624 mm		120
EPF8282AVTC100-4	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V		CMOS	78		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e0	357 MHz		74	220 °C (428 °F)	14 mm		78
EPM7032VLC44-15	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz			220 °C (428 °F)	16.5862 mm	No	32
EPM7032VTC44-12	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	32	CMOS			3.3	3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz			220 °C (428 °F)	10 mm	No	32
EP224PC-10	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.25 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	8 Macrocells	e0	62.5 MHz		8	220 °C (428 °F)	31.6865 mm		8
EP224PC-7	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns		No	5.25 V		CMOS	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	8 Macrocells	e0	100 MHz		8	220 °C (428 °F)	31.6865 mm		8
EP224LC-10	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	72	1.27 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	8 Macrocells	e0	62.5 MHz		8	220 °C (428 °F)	11.5062 mm		8
EP224LC-12	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.25 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	72	1.27 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	8 Macrocells	e0	90.9 MHz		8	220 °C (428 °F)	11.5062 mm		8
EP224LC-7	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	72	1.27 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	8 Macrocells	e0	100 MHz		8	220 °C (428 °F)	11.5062 mm		8
GAL16V8D-10LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	Programmable Output Polarity	e0	66.7 MHz		8		26.162 mm		8
GAL16V8D-15LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-25LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-25QP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	37 MHz		8		26.162 mm		8
GAL16V8D-10LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-10QJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No		e0	66.7 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
GAL16V8D-5LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	20	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	5.25 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.572 mm	8.9662 mm	No	Programmable Output Polarity	e0	142.8 MHz	30 s	8	225 °C (437 °F)	8.9662 mm		8
XC9536-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	36	CMOS			5	3.3/5,5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	100 MHz	30 s		240 °C (464 °F)	7 mm	Yes	34
XC9536XL-10PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9536XL-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	36	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e0	178.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9536XL-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572XL-10PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572XL-5PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e0	178.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC9572XL-7PC44C	Xilinx	Flash PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	72	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 34 I/O	0	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XC95144XL-5TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	144	CMOS	81		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	In System Programmable	e4	138.88 MHz		81		14 mm	Yes	81
XC95144XL-7TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	144	CMOS	81		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e4	125 MHz		81		14 mm	Yes	81
XC9572XL-10TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	72	CMOS	72		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e4	100 MHz		72		14 mm	Yes	72
XC9572XL-5TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS	72		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e4	178.6 MHz		72		14 mm	Yes	72
XC9572XL-7TQ100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	72	CMOS	72		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	72 Macrocells	e4	125 MHz		72		14 mm	Yes	72
XC95144XL-10TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	144	CMOS	117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	81.3 MHz		117		20 mm	Yes	117
XC95144XL-5TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	144	CMOS	117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	In System Programmable	e4	138.88 MHz		117		20 mm	Yes	117
XC95144XL-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	144	CMOS	117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	125 MHz		117		20 mm	Yes	117

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.