Commercial Programmable Logic Devices (PLD) 592

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC9536XL-10VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	100 MHz		36		10 mm	Yes	36
XC9536XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e4	125 MHz		36		10 mm	Yes	36
XC9572XL-5VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	72	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	178.6 MHz		36		10 mm	Yes	52
XC9572XL-7VQ64C	Xilinx	Flash PLD	Commercial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	72	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 52 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	72 Macrocells	e4	125 MHz		36		10 mm	Yes	52
XC95144XL-7CS144C	Xilinx	Flash PLD	Commercial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	144	CMOS	117		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V	e0	107.52 MHz	30 s	117	240 °C (464 °F)	12 mm	Yes	117
XC9536XL-5CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	36 Macrocells	e0	178.6 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC9536XL-7CS48C	Xilinx	Flash PLD	Commercial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	36 Macrocells	e0	125 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
EP324DC-25	Altera		Commercial	Through-Hole	40	DIP	Rectangular	Ceramic	25 ns		No			CMOS	36	PAL-TYPE	5	5 V	In-Line	DIP40,.6	Programmable Logic Devices				394	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T40				No		e0	33 MHz		24	220 °C (428 °F)
EPF10K100BFC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V		CMOS	191		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V		1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm		191
EPF10K100BFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V		CMOS	191		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V		1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm		191
EPF10K10AFC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	150		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		Registered	3 V		1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	17 mm		150
ISPLSI1032E-70LT	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	17.5 ns		Yes	5.25 V	128	CMOS	66	PLA-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	56 MHz	30 s	64	240 °C (464 °F)	14 mm	No	64
ISPLSI1048E-70LQ	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	128	QFP	Square	Plastic/Epoxy	18.5 ns		Yes	5.25 V	192	CMOS			5	5 V	Flatpack	QFP128,1.2SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	8 Dedicated Inputs, 96 I/O	8	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G128	3	4.1 mm	28 mm	No	Use ISPLSI1048EA for new designs	e0	56 MHz	30 s		225 °C (437 °F)	28 mm	No	96
ISPLSI1016-60LJ	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V	64	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 32 I/O	1	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	In-System Programmable; 3 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
ISPLSI2032VE-110LJ44	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	13 ns		Yes	3.6 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
ISPLSI1024-60LJ	Lattice Semiconductor	EE PLD	Commercial	No Lead	68	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V	96	CMOS			5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	2 Dedicated Inputs, 48 I/O	2	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-N68	3	4.57 mm	24.2316 mm	No	In-System Programmable; 4 External Clocks	e0	38 MHz	30 s		225 °C (437 °F)	24.2316 mm	No	48
ISPLSI1016-80LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	QFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V	64	CMOS			5	5 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	1 Dedicated Inputs, 32 I/O	1	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3		10 mm	No	In-System Programmable; 3 External Clocks	e0	50 MHz			240 °C (464 °F)	10 mm	No	32
ISPLSI1016E-80LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	18.5 ns		Yes	5.25 V	64	CMOS	35	PLA-TYPE	5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	3 Dedicated Inputs, 32 I/O	3	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	57 MHz	30 s	32	240 °C (464 °F)	10 mm	No	32
ISPLSI2032E-110LJ44	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	32	CMOS			5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
ISPLSI2032E-110LT44	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	13 ns		Yes	5.25 V	32	CMOS			5	5 V	Flatpack, Low Profile	QFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.75 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.6 mm	10 mm	No	In-System Programmable	e0	77 MHz				10 mm	No	32
XC95288XL-10BG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC95288XL-7BG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS	192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC95288XL-6TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	288	CMOS	117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	288 Macrocells	e4	208.3 MHz		117		20 mm	Yes	117
XC95288XL-10TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	288 Macrocells	e4	100 MHz		117		20 mm	Yes	117
XC95288XL-7TQ144C	Xilinx	Flash PLD	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS	117		3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 117 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	125 MHz		117		20 mm	Yes	117
XC95288XL-6PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	288	CMOS	168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	208.3 MHz		168		28 mm	Yes	168
XC95288XL-10PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS	168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	100 MHz		168		28 mm	Yes	168
XC95288XL-7PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS	168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	125 MHz		168		28 mm	Yes	168
EPF81500ARC304-2	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	1.7 ns	1296	Yes	3.6 V		CMOS	208		3.3	3.3/5,5 V	Flatpack, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Can also operate at 5 V supply	e0	417 MHz		204	220 °C (428 °F)	40 mm		208
EPF81500ARC304-4	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	1.9 ns	1296	Yes	3.6 V		CMOS	208		3.3	3.3/5,5 V	Flatpack, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Can also operate at 5 V supply	e0	357 MHz	30 s	204	220 °C (428 °F)	40 mm		208
EPF10K130VBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	3.6 V		CMOS	470		3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K130VBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.7 ns	6656	Yes	3.6 V		CMOS	470		3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K130VBC600-4	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.9 ns	6656	Yes	3.6 V		CMOS	470		3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPF10K250ABC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns	12160	Yes	3.6 V		CMOS	470		3.3	2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Registered	3 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	45 mm		470
EPF10K100GC503-3DX	Altera	Loadable PLD	Commercial	Pin/Peg	503	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.5 ns	4992	No	5.25 V		CMOS	406		5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA503,43X43	Field Programmable Gate Arrays		Registered	4.75 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P503	1	5.077 mm	57.4 mm	No		e0			406	220 °C (428 °F)	57.4 mm		406
EPF10K200EGC599-1	Altera	Loadable PLD	Commercial	Pin/Peg	599	PGA	Square	Ceramic, Metal-Sealed Cofired	0.4 ns	9984	No	2.7 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array	SPGA599,47X47	Field Programmable Gate Arrays		Mixed	2.3 V		2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	9984 Logic Elements	e0	140 MHz		470	220 °C (428 °F)	62.484 mm		470
EPF10K200EGC599-2	Altera	Loadable PLD	Commercial	Pin/Peg	599	PGA	Square	Ceramic, Metal-Sealed Cofired	0.6 ns	9984	No	2.7 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array	SPGA599,47X47	Field Programmable Gate Arrays		Mixed	2.3 V		2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	9984 Logic Elements	e0	140 MHz		470	220 °C (428 °F)	62.484 mm		470
EPF10K200EGC599-3	Altera	Loadable PLD	Commercial	Pin/Peg	599	PGA	Square	Ceramic, Metal-Sealed Cofired	0.8 ns	9984	No	2.7 V		CMOS	470		2.5	2.5,2.5/3.3 V	Grid Array	SPGA599,47X47	Field Programmable Gate Arrays		Mixed	2.3 V		2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	9984 Logic Elements	e0	140 MHz		470	220 °C (428 °F)	62.484 mm		470
EPF10K250AGC599-1	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.5 ns	12160	No	3.6 V		CMOS	470		3.3	2.5/3.3,3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays		Registered	3 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	62.484 mm		470
EPF10K250AGC599-2	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.6 ns	12160	No	3.6 V		CMOS	470		3.3	2.5/3.3,3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays		Registered	3 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	62.484 mm		470
EPF10K250AGC599-3	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.7 ns	12160	No	3.6 V		CMOS	470		3.3	2.5/3.3,3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays		Registered	3 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	62.484 mm		470
EPF10K100BQC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V		CMOS	147		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	4992 Logic Elements	e0	140 MHz		147	220 °C (428 °F)	28 mm		147
EPF10K100BQC240-1	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V		CMOS	189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e0	140 MHz		189	220 °C (428 °F)	32 mm		189
EPF10K100BQC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V		CMOS	189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e0	140 MHz		189	220 °C (428 °F)	32 mm		189
EPF10K100BQC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	14.5 ns	4992	Yes	2.7 V		CMOS	189		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e0	140 MHz		189	220 °C (428 °F)	32 mm		189
EPM9320ABC356-10	Altera	EE PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	10.8 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	144.9 MHz			220 °C (428 °F)	35 mm	Yes	168
EPM9320BC356-15	Altera	EE PLD	Commercial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA356,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 168 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	35 mm	Yes	168
EPM9320ALC84-10	Altera	EE PLD	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10.8 ns		Yes	5.25 V	320	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 60 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	144.9 MHz			220 °C (428 °F)	29.3116 mm	Yes	60

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.