ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH Circuits 66
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
40 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N18 |
.87 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.036 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
40 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N18 |
.87 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.036 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
170 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
100 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
e4 |
NOT SPECIFIED |
260 |
3 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
52 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N16 |
2 |
1 mm |
3 mm |
e4 |
NOT SPECIFIED |
260 |
3 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
135 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
ATM |
YES |
1 |
3.3 V |
3.3,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G176 |
1.6 mm |
24 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
24 mm |
|||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
118 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.035 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM |
YES |
1 |
BIPOLAR |
.037 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e0 |
245 |
8.65 mm |
|||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM |
YES |
1 |
BIPOLAR |
.046 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
||||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.0395 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
240 |
9.9 mm |
|||||||
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
BIPOLAR |
.0395 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
240 |
9.9 mm |
|||||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
185 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
185 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
10 mm |
||||||||||||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N72 |
3 |
1 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.03 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
.0415 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.041 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N10 |
.8 mm |
3 mm |
Not Qualified |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM |
YES |
1 |
BIPOLAR |
.045 mA |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.049 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.049 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
1 |
120 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Telecom ICs |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
.8 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.055 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-N20 |
1 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
118 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
100 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
18 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
.07 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-25 Cel |
UPPER |
R-XUUC-N18 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.195 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.195 mm |
||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e0 |
||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.9 mm |
||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.04 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
SONET |
YES |
1 |
44 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N19 |
.94 mm |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
1.195 mm |
||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
NO LEAD |
20 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
UNCASED CHIP |
TIN LEAD |
UPPER |
R-XUUC-N20 |
Not Qualified |
e0 |
|||||||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM |
YES |
1 |
BIPOLAR |
.045 mA |
3.3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-N20 |
1 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||
|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
SON |
SQUARE |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.041 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N10 |
1 |
.8 mm |
3 mm |
Not Qualified |
3 mm |
|||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
SONET |
YES |
1 |
BIPOLAR |
.027 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.9 mm |
|||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
ATM |
YES |
1 |
BIPOLAR |
.037 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
ATM/SONET/SDH ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e0 |
245 |
8.65 mm |
|||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
Not Qualified |
e0 |
|||||||||||||||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
BIPOLAR |
-5.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.