ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH Circuits 66
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
ATM; SONET |
YES |
1 |
BIPOLAR |
.0415 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
245 |
3 mm |
|||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
.028 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
45 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
ATM/SONET/SDH ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.169 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.185 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
|
Analog Devices |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
CMOS |
.185 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||
|
Maxim Integrated |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
7 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
R-XUUC-N7 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
40 mA |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
.87 mm |
Data rate is 11.3 Gbps |
1.036 mm |
||||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
40 mA |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
.87 mm |
Data rate is 11.3 Gbps |
1.036 mm |
||||||||||||||||||
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
40 mA |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
.87 mm |
Data rate is 11.3 Gbps |
1.036 mm |
||||||||||||||||||
|
Infineon Technologies |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
2.13 mm |
27 mm |
27 mm |
||||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
76 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
1.45 mm |
Data rate is 28 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
3.25 mm |
||||||||||||||||
|
|
Texas Instruments |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
76 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
36 mA |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
1.45 mm |
Data rate is 28 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
3.25 mm |
|||||||||||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SONET;SDH |
YES |
1 |
242 mA |
1.8 V |
GRID ARRAY |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B144 |
1.95 mm |
13 mm |
13 mm |
|||||||||||||||
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
BALL |
500 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY |
BOTTOM |
S-PBGA-B500 |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.