RECTANGULAR Cellphone ICs 86

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SX8653IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			DUAL	R-PDSO-N14		.8 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ACFM-7103-BLK	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO							MICROELECTRONIC ASSEMBLY								DUAL	R-XDMA-N7
ACFM-7103-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO							MICROELECTRONIC ASSEMBLY								DUAL	R-XDMA-N7
LMH6523SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD	R-XQCC-N54	2	.8 mm	5.5 mm		e3	30	260	10 mm
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-35 Cel			QUAD	R-XQMA-N22	3	.9 mm	2.5 mm				260	3.2 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
CC1050-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm		e4	30	260	7.8 mm
CC1050-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm		e4	30	260	7.8 mm
MAX2690EUB	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G10	1	1.092 mm	2.9465 mm	Not Qualified	e0			3 mm
CC1000PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	9.7 mm
CC1000PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	9.7 mm
MAX2440EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.036 mA	3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2421EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
MAX2422EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e0			10.2 mm
ALM-2412-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			2 mm	85 Cel	-40 Cel			BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified			260	3.3 mm
ALM-2412-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			2 mm	85 Cel	-40 Cel			BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified			260	3.3 mm
ALM-2712-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		CHIP CARRIER			1.25 mm					BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
ALM-2712-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		CHIP CARRIER			1.25 mm					BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
MAX2312EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
TRF4900PW	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	70 Cel	0 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4400PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4900PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	70 Cel	0 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-BT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-GTR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified	e3		260	7.8 mm
SI4136-F-GT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified	e3		260	7.8 mm
CC1000PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	9.7 mm
CC1000YZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified				4.034 mm
CC1000YZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified				4.034 mm
TRF4400PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
ACFM-7102-BLK	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel			UNSPECIFIED	R-XXMA-X6	3			Not Qualified
ACFM-7102-TR1	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel			UNSPECIFIED	R-XXMA-X6	3			Not Qualified
CC1000-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	9.7 mm
CC1000-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	9.7 mm
1605C	Murata Manufacturing	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	UNSPECIFIED	NO	1						IN-LINE			2.54 mm	70 Cel	0 Cel			DUAL	R-XDIP-T16		6.84 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	22.5 mm
MAX2392ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES			BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX2396EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES			BICMOS	.038 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX2401ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES			BICMOS	.043 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	R-XQCC-N28	1			Not Qualified
ALM-1522-BLKG	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1				5 V		MICROELECTRONIC ASSEMBLY								QUAD	R-XQMA-N22	2			Not Qualified			260
SA601DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA601DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA620DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
SA620DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
ACFM-7101-TR1G	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel			UNSPECIFIED	R-XXMA-X6	3			Not Qualified			260
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-N14	2	.8 mm	3 mm	Not Qualified	e3		260	4 mm
TRF4900PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2607EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.