RECTANGULAR Cellphone ICs 86

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2608EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified		e0			2.9 mm
MAX2609EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified		e0			2.9 mm
DSL01-010SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1			Not Qualified		e4	30	260
DSL01-024SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1			Not Qualified		e4	30	260
TRF4903PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
MAX2685EEE-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified		e0			4.89 mm
MAX2690EUB-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G10	1	1.092 mm	2.9465 mm	Not Qualified		e0			3 mm
AD8348ARUZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
TRF4903PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4900PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm
TRF4903PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4903PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
ADF7901BRUZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	7.8 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm
CC1050PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
CC1050PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
CC1050PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
LARA-R211-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	300 mA	3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XLGA-N100	4	2.87 mm	24 mm		-40 to 85 extended operating temp available				26 mm
LISA-U200-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	76	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		QUAD	R-XQMA-N76		2.87 mm	22.4 mm						33.2 mm
TOBY-L210-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
TOBY-L210-65S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
TOBY-L280-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N152	4	2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE			1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm			e3	30	245	15.9 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm			e3			15.9 mm
J-N3-B3E6-LR	Telit Communications Plc	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-N24		2.4 mm	12.2 mm						16 mm
A2I25H060GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS			28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm			e3	40	260	17.53 mm
A2I25H060NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS			28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm			e3	40	260	17.53 mm
LARA-R202-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel	-20 Cel		BOTTOM	R-XLGA-N100	4	2.87 mm	24 mm		-40 to 85 extended operating temp available			245	26 mm
EG91EXGA-128-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	102	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		UNSPECIFIED	R-XXMA-N102		2.3 mm	25 mm		Also has Extended temp from -40 Deg c to 85 Deg c				29 mm
NRF9160-SIBA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SIBA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-N127		1.1 mm	10.5 mm						16 mm
M95FA-03-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	42	QMA	RECTANGULAR	UNSPECIFIED	YES	1				4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N42		2.65 mm	19.9 mm						23.6 mm
ACPM-7788-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	42		RECTANGULAR		YES	1													QUAD	R-XQCC-N42		.9 mm	5 mm						7 mm
EG25GGC-128-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD		SMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		SINGLE	R-XSMA-N		4.9 mm	30 mm		also available Extended Temperature Range -40 to 80 degree Celsius				51 mm
BC66NB-04-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	58	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		QUAD	R-XQMA-N58		2 mm	15.8 mm		EXTENDED TEMP AVAILABLE WITH -40 TO 85				17.7 mm
BG95M1LA-64-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	102	QMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		QUAD	R-XQMA-N102		2.2 mm	19.9 mm		EXTENDED TEMP AVAILABLE WITH -40 TO 85				23.6 mm
TOBY-L210-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM	R-XBGA-N152		2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.