RF AND BASEBAND CIRCUIT Cellphone ICs 282

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI4136-F-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.031 mA	3 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	3	.9 mm	5 mm	Not Qualified		e3		260	5 mm
SI4136-F-GTR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e3		260	7.8 mm
SI4136-F-GT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e3		260	7.8 mm
AD6650ABCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B121		1.85 mm	12 mm	Not Qualified		e1			12 mm
MAX2150ETI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.107 mA	3 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified		e0			5 mm
CC1150RSTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.95 mm	4 mm	Not Qualified		e4	30	260	4 mm
CC1150RST	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.95 mm	4 mm	Not Qualified		e4	30	260	4 mm
AD8341ACPZ-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.145 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
TRF370333IRGER	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		235 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
TRF370333IRGETG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		.235 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
MAX2058ETL-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified					6 mm
MAX2058ETL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified		e0			6 mm
MAX9985ETX-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified					6 mm
MAX9985ETX	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified		e0			6 mm
CC1000PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
CC1000YZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified					4.034 mm
CC1000YZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,4X7,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B28		.652 mm	2.339 mm	Not Qualified					4.034 mm
AD6657BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
AD6657BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm	Not Qualified		e1			10 mm
CC1101RTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N20	3	.95 mm	4 mm	Not Qualified		e4	30	260	4 mm
CC1101RTK	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N20	3	.95 mm	4 mm	Not Qualified		e4	30	260	4 mm
TRF4400PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF3710IRGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC1000-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
CC1000-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
ADF7020-1BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3	30	260	7 mm
MAX4003EBL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1	.67 mm	1.52 mm	Not Qualified		e0			1.52 mm
CC1110F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC1110F32RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC1110F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC1110F8RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC1110F8RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm	6 mm	Not Qualified		e4	30	260	6 mm
MAX2392ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified		e0
MAX2396EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.038 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified		e0
MAX2401ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.043 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N28	1			Not Qualified
SI4710-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4710-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4711-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4711-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4712-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4713-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4713-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SA601DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
SA601DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4			6.5 mm
SA620DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
SA620DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
SKY73420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-XQCC-N36		.9 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
ADS58C20IPFPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3	1.2 mm	12 mm		3.45 V	e4	30	260	12 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.