RF AND BASEBAND CIRCUIT Cellphone ICs 282

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADS58C20IPFP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G80		3	1.2 mm	12 mm			3.45 V	e4	30	260	12 mm
ADS58C23IPFPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G80		3	1.2 mm	12 mm			3.45 V	e4	30	260	12 mm
MAX2902EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					4.5 V	2.7/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N28		1	.9 mm	5 mm	Not Qualified			e0			5 mm
MAX2904EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					4.5 V	2.7/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N28		1	.9 mm	5 mm	Not Qualified			e0			5 mm
TRF4900PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel		-20 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
MAX2361EGM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e0			7 mm
TRF6901PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				.04 mA	2.7 V	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
MAX2620E/D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1			BIPOLAR		3 V		UNCASED CHIP				85 Cel		-40 Cel	TIN LEAD		UPPER	X-XUUC-N		1			Not Qualified			e0	20	240
MAX2620EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX9982ETP	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e0			5 mm
MAX9989ETP	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		5 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e0			5 mm
MAX4003EBL-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD		BOTTOM	S-PBGA-B8		1	.67 mm	1.52 mm	Not Qualified			e0			1.52 mm
MAX4003EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
TRF5901PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
MAX2010ETI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS	.0121 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N28		1	.8 mm	5 mm	Not Qualified			e0			5 mm
TRF6903PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
GC5316IZED	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.5 V	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA388,26X26,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B388		3	2.5 mm	27 mm	Not Qualified			e1	30	260	27 mm
TRF4903PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
MAX2388EGC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1					2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N12		1	.9 mm	3 mm	Not Qualified			e0			3 mm
MAX2620EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
MAX2685EEE-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	R-PDSO-G16		1	1.73 mm	3.9 mm	Not Qualified			e0			4.89 mm
MAX2690EUB-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	R-PDSO-G10		1	1.092 mm	2.9465 mm	Not Qualified			e0			3 mm
MAX4003EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD		DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
MAX5865ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS		3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE		.8 mm	7 mm	Not Qualified	DIFFERENTIAL	1.5 V	e0			7 mm
MAX9989ETP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS		5 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N20		1	.8 mm	5 mm	Not Qualified			e0			5 mm
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B256		3	1.85 mm	17 mm	Not Qualified			e1		260	17 mm
AD6636CBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	S-PBGA-B256		3	1.85 mm	17 mm	Not Qualified			e1		260	17 mm
AD8340ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BIPOLAR	.15 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified			e3		260	4 mm
TRF4903PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
CC1020RUZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N32		3	1 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC1020RUZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N32		3	1 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC1101RTKG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N20		3	.95 mm	4 mm	Not Qualified			e4	30	260	4 mm
CC1101RTKRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N20		3	.95 mm	4 mm	Not Qualified			e4	30	260	4 mm
TRF4900PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel		-20 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4903PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4903PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
ADF7901BRUZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	MATTE TIN		DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified			e3	30	260	7.8 mm
TRF6903PTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC1050PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	7.8 mm
CC1050PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	7.8 mm
CC1050PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	7.8 mm
CC2420-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC2420-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
TRF6900APTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.05 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	60 Cel		-20 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
CC2420Z-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
SKY65048-360LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	S-PDSO-N8		1	1 mm	2 mm	Not Qualified			e3		260	2 mm
ADF7021-VBCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified			e3	30	260	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.